Fujitsu Corporation

Fujitsu Vlsi Limited

Noriaki Sato

Fumitake Mieno

Kazunori Imaoka

Kenji Nishida

Kazuhiro Yoshida

Kunihiko Wada

Motoo Nakano

Mikio Takagi

Hajime Kamioka

Satoru Yamaguchi

Takashi Iwai

A semiconductor-on-insulator (SOI) type semiconductor device with an enhanced electrostatic discharge (ESD) tolerance having a semiconductor layer on an insulating support substrate, comprising a pair of voltage supply lines formed on the semiconductor layer, a pair of low resistivity semiconductor regions connected to said pair of source supplying lines and disposed within the layer, and a dielectric region disposed between said pair of low resistivity semiconductor regions; wherein said pair of low resistivity semiconductor regions form a capacitor.

ESD tolerated SOI device

An EPROM allowing a miniaturization of an isolation region (a field insulating layer) without generating a parasitic transistor. The EPROM comprises a semiconductor substrate; a field insulating layer defining a device formation region of the semiconductor substrate; a gate insulating layer; a floating gate formed on the field insulating layer and the field insulating layer; a trench insulating layer extending into the semiconductor substrate at the center portion of the field insulating layer, one of the side walls of the trench insulating layer being self-aligned with the end face of the floating gate; a first interlaminar insulating layer covering the floating gate; a control gate located above the floating gate; a second interlaminar insulating layer formed over the whole surface; and a bit line.

Method of producing an EPROM with a trench insulating layer

A structure and its fabrication method of an integrated semiconductor device including circuit elements such as MOSFETs. A well is formed in the semiconductor substrate within windows of a field oxide layer. A lightly-doped semiconductor layer is selectively formed on the exposed surface of the well. A channel region and a pair of source and drain regions of a MOSFET are formed in the lightly-doped semiconductor layer. The highly-doped buried semiconductor layer of the same conductivity type as that of the lightly-doped semiconductor layer is formed under the channel region in the lightly-doped semiconductor layer. The structural features and fabrication method provides a great degree of freedom in designing a MOSFET having a further shorter-channel length without deteriorating its drivability and punch-through breakdown voltage.

An integrated semiconductor device having a buried semiconductor layer

A CAD system designs mask patterns for use in a master slice integrated circuit processing. The system includes an input device such as a mouse interface, and a display unit for symbolically displaying circuit elements and cells. A first data base stores a net list of circuit design information. A second data base stores data relating to the structure of a master slice bulk and various types of elemental cells formed in the master slice. A processing unit of the CAD system causes the display unit to display both a circuit design scheme and the master slice bulk on a screen of the display unit. The processing unit produces data about the initial positions of a pair of contact hole patterns by which a resistor is defined in a resistive cell region of the master slice, and automatically shifts the contact hole patterns from the initial positions to another position, in order to avoid interference between a wiring pattern on the master slice bulk and the contact hole patterns.

Method and apparatus for designing integrated circuits according to

A contact structure for connecting a semiconductor device to a wiring electrode includes a semiconductor layer forming a part of the semiconductor device. A first contact layer of reduced resistivity covers a surface of the semiconductor layer. An insulating structure is provided on the first contact layer so as to bury the first contact layer underneath. A penetrating hole is opened through the insulating structure so as to expose a part of the first contact layer. A second contact layer of reduced resistivity is provided on the part of the first contact layer exposed by the penetrating hole. The second contact layer extends from a bottom of the penetrating hole along its side wall. A conductor layer forms the wiring electrode on the second contact layer.

Contact structure for connecting an electrode to a semiconductor device

An erasable-programmable read only memory (EPROM) allowing a miniaturization of an isolation region (a field insulating layer) without generating a parasitic transistor. The EPROM includes a semiconductor substrate, a field insulating layer defining a device formation region of the semiconductor substrate, a gate insulating layer and a floating gate formed on the field insulating layer and the field insulating layer. The EPROM further includes a trench insulating layer extending into the semiconductor substrate at the center portion of the field insulating layer so that one of the side walls of the trench insulating layer is self-aligned with the end face of the floating gate. A first interlaminar insulating layer covers the floating gate, and a control gate is located above the first interlaminar insulating layer. A second interlaminar insulating layer is formed over the control gate and a bit line is formed on the second interlaminar insulating layer.

EPROM with trench in thick field oxide

A contact structure for connecting a semiconductor device to a wiring electrode includes a semiconductor layer forming a part of the semiconductor device. A first contact layer of reduced resistivity covers a surface of the semiconductor layer. An insulating structure is provided on the first contact layer so as to bury the first contact layer underneath. A penetrating hole is opened through the insulating structure so as to expose a part of the first contact layer. A second contact layer of reduced resistivity is provided on the part of the first contact layer exposed by the penetrating hole. The second contact layer extends from a bottom of the penetrating hole along its side wall. A conductor layer forms the wiring electrode provided on the second contact layer.

Contact structure for connecting an electrode to a semiconductor

Integrated semiconductor device having a buried semiconductor layer and

A semiconductor device including a semiconductor substrate with a P-type well formed in the semiconductor substrate and a gate insulator layer formed on the semiconductor substrate. N-type diffusion regions are formed in the P-type well on both sides of the gate insulator layer. A gate electrode is formed on the gate insulator layer, where the gate electrode has top and side surfaces. The gate electrode and the N-type diffusion regions respectively form gate, source and drain of a N-channel MOS transistor. An insulating layer covers a portion of the N-type diffusion regions, the side surfaces of the gate electrode and at least a portion of the top surface of the gate electrode. The side wall layer which is made of an insulating material is formed on the insulating layer to provide a smooth coverage around the side of the gate electrode and aligns with an edge of said insulating layer which stops covering the N-type diffusion regions.

Semiconductor device having MOS transistor and a sidewall with a double

A metal-oxide-semiconductor device having a semiconductor-on-insulator structure comprises an insulator substrate; a single crystal semiconductor substrate provided on the insulator substrate, the single crystal semiconductor substrate and the insulator substrate forming a part of the semiconductor-on-insulator structure; source and drain regions doped to a first conduction type and defined in the single crystal semiconductor substrate; a channel region defined in the single crystal semiconductor substrate so as to be interposed between the source and drain regions, the channel region being doped to a second conduction type opposite to the first conduction type with a first impurity concentration level; a gate insulator film provided on the single crystal semiconductor substrate in correspondence to the channel region; and a gate electrode provided on the gate insulator film in correspondence to the channel region with a predetermined gate length; wherein the channel region is defined by a back channel elimination region having an increased impurity concentration level exceeding the first impurity concentration level such that the back channel elimination region is located adjacent to the insulator substrate for eliminating the back channel effect, the back channel elimination region being provided under the gate electrode in a manner such that the back channel elimination region is separated from the source and the drain regions by a region having a smaller impurity concentration level.

Method of fabricating a metal-oxide-semiconductor device having a

A semiconductor memory circuit comprises a plurality of memory cells and a plurality of programming transistors, each memory cell being provided at the intersections of one bit line and one word line. The memory cell includes an insulator and a cell transistor, and a conductivity type of the cell transistor selected by a word line select signal is opposite to that of the programming transistor selected by a bit line select signal. The memory cell is programmed by utilizing an electrical breakdown of the insulator, when the bit line select signal and the word line select signal supplied are in-phase and both the programming transistor and the cell transistor are switched. Therefore, the memory cell is programmed in a short time during which the programming transistor and the cell transistor are switched, and thus this semiconductor memory circuit can be programmed with a low consumption of power and of a high speed.

Semiconductor memory circuit

A BIC memory cell device comprises a first insulating layer covering a MOS structure, a first penetrating opening in the first insulating layer in correspondence to a drain region and defined by an inclined first side wall which defines the diameter of the first opening such that the diameter increases towards a top surface of the first insulating layer, a second penetrating opening in the first insulating layer in correspondence to a source region and defined by a second side wall having a straight vertical cross section, a third penetrating opening in the first insulating layer in correspondence to a gate electrode and defined by a third side wall having a straight vertical cross section, a second insulating layer provided on the first insulating layer in correspondence to the drain region, a first wiring electrode deposited such that the second insulating layer is sandwiched between the first wiring electrode and the drain region, and second and third wiring electrodes contacting with the source region and the gate electrode.

Method of making a BIC memory cell having contact openings with straight

A programmable semiconductor read only memory device which includes a memory cell array formed by a plurality of memory cells arranged in a matrix arrangement. Each memory cell in the memory cell array includes a transistor having a gate thereof coupled to a word line, and a capacitor having an insulator layer, having a first terminal coupled to a bit line and having a second terminal coupled to the transistor so that the capacitor is grounded via the transistor. The insulator layer of the capacitor of a selected memory cell breaks down when a specific word line and a specific bit line coupled to the selected memory cell are driven, thereby making the capacitor conductive.

Programmable semiconductor read only memory device

A semiconductor device with a fuse including an insulating layer having at least one step. A fusible film on the insulating layer crosses the step and a covering film is formed on the fusible film, the step and the insulating layer. When the portion of the fusible film crossing the step is irradiated with a laser beam the portion of the fusible film on the upper surface of the insulating layer melts and flows onto the lower surface of the insulating layer without forming a hole, thereby separating the fusible film at the step.

Growing community of inventors

Kawasaki, Japan

Noriaki Sato