Tokyo Electron Limited

Nobuyuki Sata

Eiichi Shirakawa

Shuji Iwanaga

Takahiro Kitano

Toshiyuki Matsumoto

Tomohide Minami

Masatoshi Kaneda

Tetsuo Fukuoka

Toshichika Takei

Shouichi Terada

Kenichi Shigetomi

An object of the present invention is to perform temperature setting of a heating plate so that a wafer is uniformly heated in an actual heat processing time. The temperature of a wafer is measured during a heat processing period from immediately after a temperature measuring wafer is mounted on the heating plate to the time when the actual heat processing time elapses. Whether the uniformity in temperature within the wafer is allowable or not is determined from the temperature of the wafer in the heat processing period, and if the determination result is negative, a correction value for a temperature setting parameter of the heating plate is calculated using a correction value calculation model from the measurement result, and the temperature setting parameter is changed.

Temperature setting method of heat processing plate, temperature setting apparatus of heat processing plate, program, and computer-readable recording medium recording program thereon

This invention provides a wafer-type temperature sensor capable of eliminating the need for an A/D converter, adapting itself to automation and improving the heat resistance to measure temperature distribution of the upper surface of a wafer, a temperature measuring device using the sensor, a thermal processor having a temperature measurement function and a temperature measurement method. The wafer-type temperature sensor comprises a wafer and a plurality of temperature sensors arranged in regions which are formed by segmenting the upper surface of the wafer into a plurality of regions. Each of the temperature sensors includes an oscillation circuit for oscillating a frequency signal corresponding to the temperature of its own region within a frequency band that is different for every region in response to input of power supply voltage.

Temperature measuring device using oscillating frequency signals

A heat treatment table is divided into two or more regions, a heater is disposed for each region. On a predetermined portion of the heat treatment table, a plurality of sensors are disposed separately each other. A relation between temperatures of the respective portions on the heat treatment table and temperatures detected by the sensors is grasped in advance, thereby enables to surmise a temperature of the respective portion of the heat treatment table from the temperature detected by the sensors. In the case of an wafer being actually treated by placing on the heat treatment table, the temperatures detected by the sensors are observed, from these detected temperatures, the temperatures of the respective portions on the heat treatment table, that is, temperatures affecting the wafer, are surmised.

Heat treatment apparatus

In a liquid processing apparatus a spin chuck holds a wafer having a surface supplied with a liquid to be applied through a nozzle receiving the liquid through a feed path and whether the liquid passing through the feed path has fluctuation is detected by a fluctuation detection device. Thus the liquid's condition in the feed path can be determined significantly accurately. Supplying the substrate with the liquid without fluctuation allows the substrate to receive the liquid in an optimal condition. A satisfactory liquid process can thus be performed.

Liquid processing apparatus processing a substrate surface with a processing liquid, liquid processing method, and liquid condition detection apparatus detecting fluctuation of the processing liquid

A reference value, which defines electric power to be supplied to a heating element, is generated. Deviation &#x394;T of temperature Tmeasured by a radiation thermometer from target temperature Tdefined by a target temperature rising curve is determined. Compensation value is determined based on the deviation &#x394;T and the temperature T. The reference value is multiplied by the compensation value. The heating element is supplied with electric power according to the corrected reference value.

Heat treatment apparatus and heat treatment method

Immediately after a cold substrate G is placed on a substrate table, a large electric power Pis supplied to a heating elementembedded in the substrate table for a time period Tso that temperature of the substrate table overshoots a target temperature, and thereafter zero or very small electric power Pis supplied to the heating element for a time period Tso that the temperature of the substrate tableis lowered to the target temperature while temperature of the substrate continues to rise up to the target temperature. When both the temperature of the substrate table and of the substrate reaches approximately to the target temperature after the time period Thas elapsed, control of the electric power is entrusted to a PID controller.

Substrate processing apparatus and substrate processing method

The heat treatment apparatus of the present invention comprises a chamber, a hot plate for supporting and heating a substrate in a chamber, a gas supply mechanism having a single or a plurality of gas blow-out ports and arranged in an upper space above the hot plate in the chamber, for supplying a gas along the substrate so as to cover the substrate placed on the hot plate, and an exhaust mechanism having a single or a plurality of gas converge/exhaust ports which face the gas blow-out ports with the hot plate interposed therebetween, for converging and exhausting the gas blown out from the gas blow-out ports, from the chamber, the gas converge/exhaust ports having an effective exhaustion opening length L which is shorter than an effective blow-out opening length L

Heat treatment apparatus and substrate processing system

The heat treatment apparatus of the present invention comprises a chamber, a hot plate for supporting and heating a substrate in a chamber, a gas supply mechanism having a single or a plurality of gas blow-out ports and arranged in an upper space above the hot plate in the chamber, for supplying a gas along the substrate so as to cover the substrate placed on the hot plate, and an exhaust mechanism having a single or a plurality of gas converge/exhaust ports which face the gas blow-out ports with the hot plate interposed therebetween, for converging and exhausting the gas blown out from the gas blow-out ports, from the chamber, the gas converge/exhaust ports having an effective exhaustion opening length L,which is shorter than an effective blow-out opening length L

A heating treatment apparatus comprises a hot plate on which a substrate to be processed is to be mounted, a heater for heating the hot plate, a plurality of first sensors for detecting temperatures of a plurality of portions of the hot plate, respectively, a second sensor for detecting temperature of a representative portion of the hot plate, and a controller for controlling a heat generating operation of the heater on the basis of a plurality of first detection temperatures detected by the first sensors respectively and a second detection temperature detected by the second sensor, thereby controlling temperature of the hot plate.

A heat treating apparatus comprises a hot plate having a top surface on which is placed a substrate that is to be subjected to a heat treatment, setting means for setting an original target temperature of the hot plate required for subjecting the substrate to a heat treatment, a heat energy supply source for supplying a heat energy to the hot plate, a sensor for detecting the temperature of the hot plate, and control means receiving a detection signal from the sensor to obtain a difference in the detected temperature of the hot plate between the state that the substrate is not placed on the hot plate and the state that the substrate is placed on the hot plate, the original target temperature being switched based on the difference, and a signal denoting the switched target temperature in place of the original target temperature being supplied from the control means to the heat energy supply source.

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Kumamoto, Japan

Nobuyuki Sata