Applied Materials, Inc.

Negevtech Ltd.

Applied Materials South East Asia Pte. Ltd.

Orbotech Limited

Optrotech Ltd.

Opal Technologies Ltd.

Noam Dotan

Dov Furman

Gad Neumann

Mark Wagner

Shai Silberstein

Ram Segal

Abraham Gross

Erez Sali

Efraim Miklatzky

Yigal Katzir

Tomer Yanir

Alexander Kadyshevitch

Dov Shachal

Ran Zaslavsky

Asher Pearl

Dubi Shachal

Sergio Serulnik

Yuval Dorfan

Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described. Other novel aspects of the system include a system for compensating for variations in the pulse energy of a Q-switched laser output, methods for autofocussing of the wafer imaging system, and novel methods for removal of repetitive features of the image by means of Fourier plane filtering, to enable easier detection of wafer defects.

System for detection of wafer defects

A method for inspecting a wafer including a multiplicity of dies, the method including dividing an image of at least a portion of the wafer into a plurality of sub-images each representing a sub-portion of the wafer and selecting at least one defect candidate within each sub-image by comparing each sub-image to a corresponding sub-image of a reference including a representation, which is assumed to be faultless, of the portion of the wafer.

Method and apparatus for detecting defects in wafers

An inspection system for inspecting an object, the system comprising an illuminator including at least one pulsed light source, a detector assembly, and a relative motion provider operative to provide motion of the object relative to the detector assembly, along an axis of motion, the detector assembly comprising a plurality of 2-dimensional detector units whose active areas are arranged at intervals.

Multi mode inspection method and apparatus

Apparatus for determining optimum position of focus of an imaging system

System for detection of water defects

An inspection system for inspecting an object, the system comprising an illuminator including at least one pulsed light source, a detector assembly, and a relative motion provider operative to provide motion of the object relative to the detector assembly, alone an axis of motion, the detector assembly comprising a plurality of 2-dimensional detector units whose active areas are arranged at intervals.

A fiber optical illumination delivery system, which is effective in reducing the effects of source coherence. The system preferably utilizes either a single bundle of optical fibers, or serial bundles of optical fibers. In the single bundle embodiment, the differences in optical lengths between different fibers of the bundle is preferably made to be equal to even less than the coherence length of the source illumination. In the serial bundle embodiment, the fibers in the other bundle are arranged as groups of fibers of the same length, and it is the difference in lengths of these groups which is made equal to, or even more preferably, less than the overall difference in length between the shortest and the longest fibers in the other bundle. Both of these fiber systems enable construction of illumination systems delivering a higher level of illumination, but without greatly affecting the coherence breaking abilities of the system, thus enabling a generally more applicable system to be constructed.

Fiber optical illumination system

A system and a method for fast characterization of sample's material composition, which is especially beneficial for semiconductor fabrication. The material composition is characterized by analyzing secondary electrons emission from the sample. According to one feature, electron detector is used to collect secondary electrons emanating from the sample. The detector is controlled to collect a specific narrow band of secondary electrons, and the band is controlled to allow for collection of SE at different energies. Two modes are disclosed: spot mode and secondary electron spectroscopy material imaging (SESMI). In the spot mode, a spectrum of SE is obtained from a single spot on the sample, and its characteristics are investigated to obtain information of the material composition of the spot. In the SESMI mode, an SEM image of an area on the sample is obtained. The SE spectrum at each pixel is investigated and correlated to a particular spectrum group. The image is then coded according to the SE spectrum grouping. The coding is preferably a color coding.

Secondary electron spectroscopy method and system

According to one aspect of the present invention, there is provided a method for controlling of charged particle beam to compensate for a potential being present on a specimen, the method comprising the steps of: moving a charged particle beam over the specimen; measuring at least one secondary product and/or backscattered particles coming from the specimen to produce an image signal; scoring the image signal; changing the beam energy; analyzing the scores achieved with different beam energies; and adjusting the beam energy based on the analysis, to compensate for the potential being present on the specimen.

Focusing method and system

An apparatus and method are disclosed for reviewing defects on an object. The apparatus includes a stage for receiving the object thereon, and both an optical microscope and a scanning electron microscope (SEM). The optical microscope is used to redetect previously mapped defects on the object surface, and includes an illumination source that directs a beam of light toward a selected portion of the object surface. The optical microscope is configured to generate either, or both, bright field and dark field illumination. Once the defect has been redetected, a translation system moves the stage a predetermined displacement such that the defect is positioned for review by the SEM. The apparatus can be configured to automatically focus the defect for viewing by the SEM, and rotate the stage to obtain varying perspectives of the defect.

Apparatus and method for reviewing defects on an object

Growing community of inventors

Givataim, Israel

Noam Dotan