Silecs Oy

Nigel Hackera

Juha T Rantala

Jason S Reid

William McLaughlin

Nina Pirilä

A method of forming a low dielectric constant structure. The method comprises providing at a first temperature a dielectric material having a first dielectric constant and a first elastic modulus, and curing the dielectric material by a thermal curing process, in which the material is heated to a second temperature by increasing the temperature at an average rate of at least 1&#xb0; C. per second. As a result a densified, dielectric material is obtained which has a low dielectric constant.

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Espoo, Finland

Nigel Hackera