Canon Kabushiki Kaisha

Naoto Ohkawa

Shinichiro Hirai

Masatoshi Endo

Junichi Motojima

Akihiko Kawamura

Tetsuji Kazaana

Takanori Morooka

The present invention provides an exposure apparatus which exposes a substrate, comprising a measurement unit configured to measure a height of the substrate at each of a plurality of measurement points, and a control unit configured to control the height of the substrate based on measurement results obtained by the measurement unit, and control an operation to arrange a shot region of the substrate in a first position and expose the shot region, wherein the shot region includes a plurality of partial regions, and the control unit causes the measurement unit to measure the height of the substrate by arranging the shot region in a second position different from the first position so that the number of measurement points arranged in the plurality of partial regions is larger than that when arranging the shot region in the first position.

Exposure apparatus, exposure method, and method of manufacturing article

The present invention provides a method of obtaining a position of a second shot region next to a first shot region, out of a plurality of shot regions formed on a substrate, comprising a first detection step of detecting a position of a first mark arranged in the first shot region, a second detection step of detecting a position of a mark more distant from the first mark, out of a second mark and a third mark arranged in the second shot region, and a determination step of determining the position of the second shot region based on a detection result in the first detection step and a detection result in the second detection step.

Method of obtaining position, exposure method, and method of manufacturing article

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Utsunomiya, Japan

Naoto Ohkawa