Shin-etsu Handotai Co., Ltd.

Naotaka Toyama

Hisashi Masumura

Fumio Suzuki

Kouichi Okamura

Kouzi Morita

Koichi Kanaya

Kouichi Tanaka

Hideki Munakata

Masayoshi Sekizawa

Takashi Matsuoka

There is disclosed a method for manufacturing a polishing pad that is formed of a urethane foam pad and attached to a turn table to polish a wafer, the method comprising at least steps of: slicing a urethane foam cake to provide the urethane foam pad; and performing press processing with respect to the urethane foam pad with a pressure of 15000 g/cmor above, a polishing pad manufactured by this method, and a method for polishing a wafer by using this polishing pad. There can be provided a method for manufacturing a polishing pad that can stably obtain a wafer with high flatness, etc.

Method for manufacturing polishing pad, and method for polishing wafer

Provided are a wafer polishing method in which, in single side polishing, covering a wafer holding surface (one side surface) with a protective film, a wafer polishing surface (the other side surface) is polished, so that the wafer holding surface can be prevented from being etched and contaminated by a polishing agent; a wafer cleaning method in which the protective film that remains behind on the wafer holding surface after polishing can be efficiently removed, and a waste cleaning solution is easily treated; and a wafer protective film that sufficiently covers the wafer holding surface in polishing but is effectively removed in cleaning. In a wafer polishing method in which a wafer holding surface of one side surface of a wafer is held and a wafer polishing surface of the other side surface thereof is polished while dripping a polishing agent, the wafer polishing surface is polished while covering the wafer holding surface with a synthetic resin protective film of etching resistance against the polishing agent, good adhesiveness to the wafer and a property easy to peel off from the wafer after polishing.

Wafer polishing method, wafer cleaning method and wafer protective film

A workpiece holder for polishing comprising a workpiece holder body which is provided with multiple perforated holes for holding a workpiece by vacuum suction and a holder back plate which is closely contacted with a back face of the holder body and has grooves for vacuum, wherein the holder back plate is composed of a synthetic resin and has an Asker C hardness of 70 or higher but lower than 98, and an apparatus for polishing a workpiece and a method for polishing a workpiece utilizing it. By improving the material of holder back plate of a workpiece holder for polishing that holds a workpiece by vacuum suction to enhance sealing with the holder body, thereby developing such a holder back plate that should not transfer deformation of the holder body to the workpiece surface, even if polishing agent slurry is introduced and solidified, to provide a workpiece holder for polishing having a workpiece holding surface of high precision, an apparatus for polishing a workpiece and a method for polishing a workpiece.

Workpiece holder for polishing, apparatus for polishing workpiece and method for polishing workpiece

By improving the material of workpiece holder body of a workpiece holder for polishing that holds a workpiece by vacuum adsorption, and the material of resin film for coating a workpiece holding surface of the holder, and developing a method for coating the surface with a resin, which does not cause blocking of perforated holes of the holder body with the resin during the resin coating process, there are provided a workpiece holder for polishing having a workpiece holding surface of high precision, and a method for producing it. According to the present invention, there are provided a workpiece holder for polishing having a workpiece holder body provided with multiple perforated holes for holding a workpiece by vacuum adsorption, wherein a holding surface of the holder body is coated with a coating film formed by applying a thermosetting resin on the holding surface and curing it with heating, and a surface of the coating film is polished, and a method for producing it.

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Gunma, Japan

Naotaka Toyama