Jx Nippon Mining Metals Corporation

Naoki Ise

Hiroshi Takamura

Ryosuke Sakashita

Yosuke Endo

A sputtering target-backing plate assembly obtained by bonding a sputtering target and a backing plate using a brazing material, wherein a braze bonding layer which bonds the sputtering target and the backing plate contains a material having thermal conductivity that is higher than that of the brazing material in an amount of 5 vol % or more and 50 vol % or less, and a thickness of the braze bonding layer is 100 &#x3bc;m or more and 700 &#x3bc;m or less. An object is to prevent the seepage of the brazing material while maintaining the thickness of the braze bonding layer.

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Ibaraki, Japan

Naoki Ise