Kabushiki Kaisha Toshiba

Naoki Hanada

Teruo Uemura

Kazuyoshi Shinada

Takahide Mizutani

Masayuki Yoshida

Tatsuo Mori

An n-channel MOSFET, a p-channel MOSFET and a nonvolatile memory cell are provided for the same semiconductor substrate. The nonvolatile memory cell is formed on the semiconductor substrate, the n-channel MOSFET is formed in a p-type well region of the semiconductor substrate, and the p-channel MOSFET is formed in an n-type well region of the semiconductor substrate.

Semiconductor device wherein n-channel MOSFET, p-channel MOSFET and

An E.sup.2 PROM and an EPROM are formed on the same substrate. An E.sup.2 PROM memory cell has a floating gate and a control gate. A tunnel insulating film is formed between the floating gate and source/drain regions, thereby constituting a memory cell of an 'FLOTOX' type. An EPROM memory cell has a floating gate and a control gate, thus constituting a memory cell of an 'SAMOS' type.

Semiconductor device having E.sup.2 PROM and EPROM in one chip

The present invention discloses a logic semiconductor device having a non-volatile memory in which a memory cell portion and a logic circuit portion are formed on a single semiconductor substrate, and a floating gate of the memory cell portion and a gate of the logic circuit portion are made of different materials, and a method of manufacturing the same.

Method of manufacturing logic semiconductor device having non-volatile

A method for manufacturing a semiconductor substrate device having a non-volatile memory cell region and a logic region including MOS transistors. A first insulating film and a first electrode layer are formed on a semiconductor substrate. Only those portions of the first insulating film and first electrode layer which are located in the logic region are removed, without removing those portions of the first insulating film and first electrode layer which are located in the non-volatile memory cell region. A sacrificial film is deposited for insulation over the entire surface of the memory cell region and logic region, and then a resist film is coated on the sacrificial film. Subsequently, impurity ions are implanted into a desired channel region located in the logic region. The resist film and sacrificial film are removed, and thereafter a second insulating film and a second electrode layer are formed.

Growing community of inventors

Yokohama, Japan

Naoki Hanada