Tokyo Electron Limited

Tokyo Electron Kyushu Limited

Naohiko Hamamura

Satoru Tanaka

Kenji Sekiguchi

Gentaro Goshi

Itaru Kanno

Teruomi Minami

Hiromi Kiyose

Takuro Masuzumi

Yoshiyuki Honda

Yasuhiro Chouno

Shinya Murakami

Eiichi Mukai

Kenji Yokomizo

Chihaya Tashima

A substrate processing method capable of suppressing particles from remaining on a surface of a substrate is provided. In the substrate processing method, a liquid film of a protection liquid is formed on the surface of the substrate, and the substrate is dried by using a supercritical fluid so that the protection liquid is removed from the surface of the substrate. After the substrate is dried, the particles remaining on the surface of the substrate is removed.

Substrate processing method, recording medium and substrate processing apparatus

A substrates-washing apparatus includes a process vessel in which washing solution is stored to wash a plurality of substrates, a boat for holding the substrates parallel to one another in the process vessel, solution supply openings formed in the bottom of the process vessel, a solution supply system communicated with the solution supply openings to supply washing solution into the process vessel through the solution supply openings, and a straightening plate arranged between the substrates held on the boat and the solution supply openings in the bottom of the process vessel and provided with a plurality of apertures through which washing solution passes. The apertures form plural lines in the longitudinal direction of the straightening plate, the apertures in each line are arranged to correspond to the substrates alternately, and the apertures in one line are shifted from those in the other adjacent line.

Substrates-washing apparatus

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Chikushino, Japan

Naohiko Hamamura