Spansion Llc.

Naofumi Takahata

Masahiko Higashi

Yukihiro Utsuno

A method for manufacturing a semiconductor device, the method including: forming a bit line in a semiconductor substrate; forming a plurality of word lines which intersect with the bit line at predetermined intervals on the semiconductor substrate; eliminating a portion of the plurality of word lines; forming an interlayer insulating film on the semiconductor substrate; and forming a metal plug which penetrates through the interlayer insulating film and is coupled to the bit line in a region where the portion of the plurality of word lines was eliminated.

Growing community of inventors

Fukushima-ken, Japan

Naofumi Takahata