Micron Technology Incorporated

Globalfoundries Dresden Module One Limited Liability Company & Co. Kg.

Other

Globalfoundries Inc.

Globalfoundries U.S. Inc.

Nan Wu

Peter Baars

Thorsten E Kammler

Alban Zaka

Tom Herrmann

Frank Schlaphof

Disclosed is a structure including a field effect transistor (FET). The FET includes, on an insulator layer above a substrate, source/drain regions and a section of a semiconductor layer extending laterally between the source/drain regions. A primary gate structure is made of the insulator layer and a well region in the substrate opposite at least the section of the semiconductor layer extending laterally between the source/drain regions. One or two secondary gate structures are on the semiconductor layer between and near one or both of the source/drain regions, respectively. The FET can further include a patterned conformal dielectric layer, which is on the center of the semiconductor layer between the source/drain regions, and which extends onto the secondary gate structure(s). Also disclosed are methods of operating the structure by biasing the secondary gate structure(s) to adjust the effective gate length of the FET and methods of forming the structure.

Field effect transistor with adjustable effective gate length

The present disclosure relates to semiconductor structures and, more particularly, to floating-gate devices and methods of manufacture. The structure includes: a gate structure comprising a gate dielectric material and a gate electrode; and a vertically stacked capacitor over and in electrical connection to the gate electrode.

Floating-gate devices in high voltage applications

The present disclosure relates to semiconductor structures and, more particularly, to co-integrated high voltage and medium voltage devices with defect prevention structures and methods of manufacture. The structure includes: a semiconductor on insulator (SOI) region and a bulk region integrated in a single substrate; at least one active device in the bulk region; at least one active device in the SOI region; and a defect prevention structure bordering the SOI region.

Co-integrated high voltage (HV) and medium voltage (MV) field effect transistors with defect prevention structures

The present disclosure relates to semiconductor structures and, more particularly, to co-integrated high voltage and medium voltage devices and methods of manufacture. The structure includes a substrate having a semiconductor on insulator (SOI) region and a bulk region; and a first device formed on the bulk region, the first device having a first gate dielectric layer and a second gate dielectric layer surrounding the first dielectric layer, and a thickness of the first gate dielectric layer and the second gate dielectric layer being greater than a thickness of an insulator layer of the SOI region.

Co-integrated high voltage (HV) and medium voltage (MV) field effect transistors

The present disclosure provides manufacturing techniques in which the layout pattern of a RAM cell may be obtained on the basis of a single lithography step, followed by a sequence of two deposition processes, thereby resulting in a self-aligned mechanism for providing the most critical lateral dimensions for active regions. In this manner, the smallest pitch of approximately 80 nm and even less may be accomplished with superior device uniformity, while at the same time reducing overall manufacturing complexity.

Semiconductor devices including active regions in RAM areas with deposition determined pitch

There is provided an apparatus includes a substrate having a main surface, a wordline buried in the substrate and a bitline buried in a shallower area than the wordline in the substrate.

Semiconductor device having a memory cell and method of forming the same

Structures that include stacked field-effect transistors and methods for forming a structure that includes stacked field-effect transistors. A structure includes a first fin, a second fin arranged over the first fin, a first dielectric layer between the first fin and the second fin, and a first inverter. The first inverter includes a first field-effect transistor with a channel region in the first fin and a second field-effect transistor with a channel region in the second fin. The first field-effect transistor and the second field-effect transistor share a first gate structure having an overlapping arrangement with the channel region in the first fin and the channel region in the second fin. The first fin has a longitudinal axis, and the second fin has a longitudinal axis that is aligned at an angle relative to the longitudinal axis of the first fin.

Circuits constructed from stacked field-effect transistors

Structures that include vertically-arranged field-effect transistors and methods for forming a structure that includes vertically-arranged field-effect transistors. A first field-effect transistor includes a section of a first fin, a first source/drain region, and a second source/drain region. The section of the first fin is arranged between the first source/drain region and the second source/drain region of the first field-effect transistor. A second field-effect transistor includes a second fin arranged over the section of the first fin, a first source/drain region, and a second source/drain region. A functional gate structure has an overlapping arrangement with the section of the first fin and also has an overlapping arrangement with a section of the second fin that is arranged between the first source/drain region and the second source/drain region of the second field-effect transistor.

Disclosed herein is a device that includes: a semiconductor substrate including a memory cell region and a peripheral circuit region arranged around the memory cell region; an element isolation region formed in the memory cell region and the peripheral circuit region; a cell active region defined by the element isolation region formed in the memory cell region; a first interlayer insulation film disposed on the cell active region, the first interlayer insulation film having a bit contact hole passing therethrough to expose a portion of an upper surface of the cell active region; and a bit line having a first metal laminated film, the bit line being disposed on the first interlayer insulation film so as to fill the bit contact hole.

Semiconductor device having metal bit line

A semiconductor device includes a semiconductor substrate having a groove and an active region adjacent to the groove; a buried gate electrode in the groove; and a capacitor contact including a first portion and a second portion over the first portion. The first portion is greater in horizontal dimension than the second portion. The first portion has a bottom surface that is in contact with an upper surface of the active region.

Semiconductor device and method of forming the same

A semiconductor device includes a semiconductor substrate including a fin. The fin includes first and second fin portions. The first fin portion extends substantially in a horizontal direction to a surface of the semiconductor substrate. The second fin portion extends substantially in a vertical direction to the surface of the semiconductor substrate. The fin has a channel region.

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Dresden, Germany

Nan Wu