Shin-etsu Handotai Co., Ltd.

Nakaji Miura

Shigetoshi Shimoyama

Masayuki Kobayashi

Kazuya Tomii

Kazutoshi Mizushima

Makoto Suzuki

Yasuhiro Sekine

Hiromitsu Ishi

In a process for polishing the chamfered peripheral part of a wafer using a polishing cloth while supplying a polishing slurry in order to improve productivity of the process by reducing a polishing time, at least two steps of polishing processes are performed in sequence. The process comprises a first polishing process to polish a particular part, e.g. the part corresponding to the {110} plane of a peripheral part of the wafer and a second polishing process in which the whole part of a peripheral part of the wafer is polished for finishing by means of varying a hardness of the polishing clothes and/or a particle size of abrasives in the slurry such as the hardness of the polishing cloth in the second polishing process being softer than that of in the first polishing process and a particle size of abrasives in the slurry in the second polishing process being finer than that of in the first polishing process.

Method for apparatus for polishing outer peripheral chamfered part of wafer

An method of separating a slice base mounting member such as a carbon member from sliced wafers, and an jig which is used for treating the wafers in the method, are disclosed. The method of separating a slice base mounting member from sliced wafers comprises the steps of; supporting a plurality of wafers having at least a slice base mounting member in a stacked state, and separating the slice base mounting member from the stacked wafers.

Method of separating slice base mounting member from wafer and jig

According to the invention, there is provided a wafer washing and drying apparatus for accurately and reliably effecting the washing of wafers after slicing, mainly the removal of foreign particles attached to the wafer end faces. The apparatus comprises a washing unit including a pluralitys of brush roller pairs for washing wafers, arranged in a row in a wafer conveying direction such that they are rotated in different directions, that is, some of them being rotated in the wafer conveying direction, and the others being rotated in the opposite direction to the wafer conveying direction, their brush bundles being arranged helically in the axial direction, at least tips of the brush hair constituting the brush hair bundles being non-linear, and a drying unit including air stream blow-out nozzles for blowing out air streams upstream with respect to the wafer conveying direction.

Washing of wafers and wafer washing and drying apparatus

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Fukushima, Japan

Nakaji Miura