United Microelectronics Corp.

Nai-Ying Lo

Chung-Hsuan Wu

Chen-Hui Huang

Yung-Yu Yang

Chia-Feng Hsiao

Tzu-Ping Kao

Cheng-Hsien Chen

Chen-Hsuan Hung

En-Wei Tsui

Yi-Hui Tseng

Shuo-Yu Chen

A wafer backside defect detection method and a wafer backside defect detection apparatus are provided. The wafer backside defect detection method includes the following steps. A peripheral edge area of a wafer backside image that at least one notch is located is cropped off. Adjacent white pixels on the wafer backside image are connected to obtain a plurality of abnormal regions. If a total area of top N of the abnormal regions is more than 10% of an area of the wafer, it is deemed that the wafer has a roughness defect. N is a natural number. If the total area of the top N of the abnormal regions is less than 1% of the area of the wafer and a largest abnormal region of the abnormal regions is longer than a predetermined length, it is deemed that the wafer has a scratch defect.

Wafer backside defect detection method and wafer backside defect detection apparatus

An automatic detection method and an automatic detection system for detecting any crack on wafer edges are provided. The automatic detection method includes the following steps. Several wafer images of several wafers are obtained. The wafer images are integrated to create a templet image. Each of the wafer images is compared with the templet image to obtain a differential image. Each of the differential images is binarized. Each of the differential images which are binarized is de-noised. Whether each of the differential images has an edge crack is detected according to pattern of each of the differential images which are de-noised.

Automatic detection method and automatic detection system for detecting crack on wafer edges

A process apparatus including a chamber, a pump, and a transportation system set between the chamber and the pump is provided. The transportation system has a pipe, a pressure control valve, and a shielding unit. The pipe has an input end connected to the chamber and an output end connected to the pump to pump fluids out of the chamber through the pipe. The pressure control valve between the input and output ends is disposed on the pipe and has a valve plate to adjust a fluid flow in the pipe. The shielding unit between the input end and the pressure control valve is disposed on the pipe and has a shielding plate to be switched between an original position and a shielding position. The shielding plate at the shielding position permits conveyance of fluids in the pipe and prevents certain liquid particles of the fluids floating in the pipe.

Process apparatus and transportation system thereof

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Kaohsiung, Taiwan

Nai-Ying Lo