USA As Represented by Secretary of the Navy

Geo-centers, Inc.

Shipley Company LLC

Mu-San Chen

Jeffrey M Calvert

Walter J Dressick

Ranganathan Shashidhar

Joel M Schnur

Banahalli R Ratna

Terrence G Vargo

Elizabeth Ann Dobisz

Jacque H Georger, Jr

Gary S Calabrese

Joseph A Gardella

Charles S Dulcey

Susan L Brandow

Brian M Peek

John F Bohland

Renate J Crawford

Kirsten A Grueneberg

This invention discloses an anti-charging layer for beam lithography and mask fabrication. This invention reduces beam displacement and increases pattern placement accuracy. The process will be used in the beam fabrication of high-resolution lithographic masks as well as beam direct write lithography of electronic devices. The anti-charging layer is formed by the use of metal films bound to metal ligating self-assembled monolayers (SAMs) as discharge layers.

Anti-charging layer for beam lithography and mask fabrication

A surface for the alignment of liquid crystals containing directionally-linked groups and compounds useful for preparing such surfaces are disclosed.

Liquid crystal composition and alignment layer

Patterned conducting polymer surfaces exhibiting excellent properties may be prepared by:

Patterned conducting polymer surfaces and process for preparing the same

A surface for the alignment of liquid crystals containing directionally-linked groups.

Fluoropolymeric substrates with metallized surfaces may be prepared by self-assembly of a chemisorbed layer of a metal ion-chelating organosilane onto a fluoropolymer surface after radio-frequency glow discharge plasma surface hydroxylation. The silane covalently binds an aqueous palladium catalyst and subsequent electroless deposition yields homogeneous or patterned metal deposits that exhibit excellent adhesion to the fluoropolymer.

Fluoropolymeric substrates with metallized surfaces and methods for

Fluroropolymeric substrates with metallized surfaces and methods for

The invention is directed to a process for patterning a substrate in a selective pattern. In one embodiment, the process comprises the steps of forming a patterned coating over a substrate surface whereby portions of the substrate are covered by the patterned coating and portions of the substrate remain uncoated. A layer of a ligating material is coated over at least those portions of the substrate free of the patterned coating. The ligating layer is one that is capable of ligating with an electroless metal plating catalyst. The article so formed is then contacted with an electroless metallization catalyst and then with an electroless plating solution to form a patterned metal deposit on the substrate.

Selective metallization process

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Ellicott City, MD, United States of America

Mu-San Chen