Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Mitsuru Hiroshima

Atsushi Harikai

Shogo Okita

Noriyuki Matsubara

Mitsuhiro Okune

Akihiro Itou

Toshihiro Wada

Syouzou Watanabe

Hiromi Asakura

Bunzi Mizuno

Katsumi Takano

Hiroyuki Suzuki

Gaku Sugahara

Tetsuhiro Iwai

Ryuzou Houchin

Nobuhiro Nishizaki

Tutomu Sakurai

Hideo Kanou

A plasma processing apparatus that performs plasma processing to a substrate held on a transport carrier including a frame and a holding sheet that covers an opening of the frame includes: a transport mechanism that transports the transport carrier; a position measuring section that measures a position of the substrate to the frame; a plasma processing section that includes a plasma processing stage on which the transport carrier is loaded and a cover that covers the frame and a part of the holding sheet loaded on the plasma processing stage, and has a window section for exposing a part of the substrate; and a control section that controls the transport mechanism such that the transport carrier is loaded on the plasma processing stage to satisfy a positional relationship between the window section and the substrate based on the position information of the substrate to the frame.

Plasma processing apparatus and plasma processing method

A semiconductor chip manufacturing method includes preparing a semiconductor wafer including a front surface on which a bump is exposed, a rear surface located at a side opposite to the front surface, a plurality of element regions in each of which the bump is formed, and a dividing region defining each of the element regions, forming a mask which covers the bump and has an opening exposing the dividing region on the surface of the semiconductor wafer by spraying liquid which contains raw material of the mask along the bump by a spray coating method, and singulating the semiconductor wafer by exposing the surface of the semiconductor wafer to first plasma and etching the dividing region, which is exposed to the opening, until the rear surface is reached in a state where the bump is covered by the mask.

Element chip manufacturing method

In a plasma processing step that is used in the method of manufacturing the element chip for manufacturing a plurality of element chips by dividing a substrate having a plurality of element regions, the substrate is divided into element chipsby exposing the substrate to a first plasma. Therefore, element chips having a first surface, a second surface, and a side surface connecting the first surface and the second surface are held spaced from each other on a carrier. A protection film covering the element chip is formed only on the side surface and it is possible to suppress creep-up of a conductive material to the side surface in the mounting step by exposing the element chips to second plasma in which a mixed gas of fluorocarbon and helium is used as a raw material gas.

Method of manufacturing element chip and element chip

An element chip manufacturing method includes a preparation process of preparing a substrate which includes a first surface having an exposed bump and a second surface opposite to the first surface and includes a plurality of element regions defined by dividing regions, a bump embedding process of embedding at least a head top part of the bump into the adhesive layer, a mask forming process of forming a mask in the second surface. The method for manufacturing the element chip includes a holding process of arranging the first surface to oppose a holding tape supported on a frame and holding the substrate on the holding tape, a placement process of placing the substrate on a stage provided inside of a plasma processing apparatus through the holding tape, after the mask forming process and the holding process.

A method for manufacturing an element chip includes a protection film stacking step of staking a protection film to the element region, and the dividing region, the part of the exposed second damaged region and a protection film etching step of removing a part of the protection film which is stacked on the dividing region and the protection film which is stacked on the element region by exposing the substrate to second plasma and remaining the protection film for covering the part of the second damaged region. Furthermore, the method for manufacturing an element chip includes a plasma dicing step of dividing the substrate to a plurality of element chips by exposing the substrate to third plasma in a state where the second main surface is supported by a supporting member.

Element chip and method for manufacturing the same

An element chip manufacturing method includes a preparation process of preparing a substrate which includes a first surface provided with a bump and a second surface and includes a plurality of element regions defined by dividing regions, a bump embedding process of adhering a protection tape having an adhesive layer to the first surface and embedding. The element chip manufacturing method includes a thinning process of grinding the second surface in a state where the protection tape is adhered to the first surface and thinning the substrate, after the bump embedding process, a mask forming process of forming a mask in the second surface and exposes the dividing regions, after the thinning process, a holding process of arranging the first surface to oppose a holding tape supported on a frame and holding the substrate on the holding tape.

The method includes a laser scribing step of forming an opening including an exposing portion, where the first layer is exposed, by irradiating the dividing region of the substrate with laser light from the first main surface side, forming a remaining region on which the second layer in the dividing region remains around the opening other than the exposing portion, and forming a first damaged region of a surface layer portion of the first layer including the exposing portion and a second damaged region of a surface layer portion of the first layer to be covered by the remaining region on the first layer of the dividing region.

Method for manufacturing element chip

In a plasma processing step that is used in the method of manufacturing the element chip for manufacturing a plurality of element chips by dividing a substrate having a plurality of element regions, the substrate is divided into the element chips by exposing the substrate to first plasma. Therefore, the element chips having a first surface, a second surface, and a side surface on which a plurality of convex portions are formed are held spaced from each other on a carrier. A protection film is formed on the side surface of the element chip by exposing the element chip to second plasma, at least convex portions formed on the side surface are covered by the protection film in the protection film formation, and creep-up of a conductive material to the side surface is suppressed in the mounting step.

A method for manufacturing an element chip includes a protection film etching step of removing a part of the protection film which is stacked on the dividing region and the protection film which is stacked on the element region through etching the protection film anisotropically by exposing the substrate to first plasma and remaining the protection film for covering an end surface of the element region. Furthermore, the method for manufacturing an element chip includes an isotropic etching step of etching the dividing region isotropically by exposing the substrate to second plasma and a plasma dicing step of dividing the substrate to a plurality of element chips including the element region by exposing the substrate to third plasma in a state where the second main surface is supported by a supporting member.

In a method of fabricating element chips, a method of forming a mask pattern, and a method of processing a substrate, a process sequence is set such that developing in which the exposure-ended protection film is patterned is performed, after grinding in which the substrate is thinned by grinding a second surface opposite to a first surface to which a photosensitive protection film is pasted. Thereby, it is possible to perform the grinding for thinning in a state where the protection film is stable without being patterned, and to prevent the substrate or the protection film on which a mask pattern of the substrate is formed from being damaged at the time of the grinding, even in a case where a thin substrate of a wafer shape becomes a target.

Method of forming mask pattern, method of processing substrate, and method of fabricating element chips

Provided is a plasma treatment method including: placing a substrate carrier holding a substrate on a stage; adjusting a distance between a cover and the stage to a first distance in which the cover covers a frame without coming into contact with the substrate carrier; performing a plasma treatment on the substrate placed on the stage after the adjusting of the distance; carrying the substrate together with the substrate carrier out from a reaction chamber after the performing of the plasma treatment; and removing an adhered substance adhered to the cover by generating plasma in the inside of the reaction chamber after the carrying of the substrate, in which the distance between the cover and the stage in the removing of the adhered substance is a second distance greater than the first distance.

Plasma treatment method and method of manufacturing electronic component

In a plasma processing step in a method of manufacturing an element chip in which a plurality of element chips are manufactured by dividing a substrate, which has a plurality of element regions, the substrate is divided into element chips by exposing the substrate to first plasma. In a protection film forming step of forming a protection film covering a side surface and a second surface by exposing the element chips to second plasma of which raw material gas is mixed gas of carbon fluoride and helium, protection film forming conditions are set such that a thickness of a second protection film of the second surface is greater than a thickness of a first protection film of the side surface.

A plasma processing apparatus includes a processing chamber, a plasma source that generates plasma within the processing chamber, a transfer carrier that has a holding sheet and a frame, the holding sheet holding a substrate, and the frame being attached to the holding sheet so as to surround the substrate, a stage that is provided within the processing chamber and has a gas supply hole formed in a mounting area of the stage for mounting the transfer carrier thereon, an electrostatic chucking part that is provided within the stage and electrostatically attracts the transfer carrier, and a gas supply part that supplies gas through the gas supply hole of the stage to assist separation of the transfer carrier from the stage.

Plasma processing apparatus and method

The plasma processing apparatus is provided with a chamber, a plasma sourcewhich generates plasma inside the chamber, a stagewhich is provided inside the chamberand places a carrierthereon, a coverwhich is arranged above the stageto cover a holding sheetand a frameand has a windowwhich is formed on a central part thereof to penetrate the coverin the thickness direction, and a drive mechanismwhich changes the position of the coverrelative to the stagebetween a first position which is away from the stageand allows the carrierto be placed on and removed from the stageand a second position which allows the coverto cover the holding sheetand the frameof the carrierplaced on the stageand a substrateheld on the holding sheetto be exposed through the window. The windowof the coverallows an area of the substrate, the area being located on the inner side with respect to an outer edge area of the substrate, to be exposed therefrom.

A plasma processing method to a substrate includes a first step of mounting a transfer carrier holding the substrate on a stage which is cooled and provided within a processing chamber; a second step of relatively moving the stage and a cover provided above the stage to cover a holding sheet and an annular frame of the transfer carrier with the substrate exposed from a window part formed at the cover, a third step of carrying out plasma processing on the substrate, a fourth step of cooling the cover, and a fifth step of unloading the transfer carrier holding the substrate from the processing chamber.

Growing community of inventors

Osaka, Japan

Mitsuru Hiroshima