Ebara Corporation

Other

Kabushiki Kaisha Toshiba

Mitsuko Odagaki

Norio Kimura

Koji Mishima

Kenji Nakamura

Hiroaki Inoue

Junji Kunisawa

Natsuki Makino

Katsuya Okumura

Hisashi Kaneko

Nobuo Hayasaka

Tetsuo Matsuda

Manabu Tsujimura

Toshiyuki Morita

Moriji Matsumoto

Takahiro Nanjo

A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portionhorizontally holding and rotating a substrate with its surface to be plated facing upward. A seal materialcontacts a peripheral edge portion of the surface, sealing the portion in a watertight manner. A cathode electrodepasses an electric current upon contact with the substrate. A cathode portionrotates integrally with the substrate holding portionAn electrode arm portionis above the cathode portionand movable horizontally and vertically and has an anodeface-down. Plating liquid is poured into a space between the surface to be plated and the anodebrought close to the surface to be plated. Thus, plating treatment and treatments incidental thereto can be performed by a single unit.

Method of performing electrolytic treatment on a conductive layer of a substrate

A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a substrate to be loaded and unloaded, a substrate treating unit for treating a substrate, and a transfer robot for transferring a substrate between the loading/unloading unit and the substrate treating unit. The loading/unloading unit, the substrate treating unit, and the transfer robot are installed in a single facility. The loading/unloading unit has a rotary table which is horizontally rotatable for positioning the substrate cassette in a position to detect the substrate cassette placed in the loading/unloading unit and to remove the substrate from the substrate cassette with the transfer robot.

Substrate processing apparatus and substrate plating apparatus

A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion horizontally holding and rotating a substrate with its surface to be plated facing upward. A seal material contacts a peripheral edge portion of the surface, sealing the portion in a watertight manner. A cathode electrode passes an electric current upon contact with the substrate. A cathode portion rotates integrally with the substrate holding portion . An electrode arm portion is above the cathode portion and movable horizontally and vertically and has an anode face-down. Plating liquid is poured into a space between the surface to be plated and the anode brought close to the surface to be plated. Thus, plating treatment and treatments incidental thereto can be performed by a single unit.

Plating apparatus

Growing community of inventors

Kanagawa-ken, Japan

Mitsuko Odagaki