Fujikoshi Machinery Corp.

Fujikoshi Kikai Kogyo Kabushiki Kaisha

Mitsue Ogawa

Yoshio Nakamura

Kenji Hashizume

Masahiro Takeuchi

Makoto Nakajima

Yasuhide Denda

Satoru Arakawa

Toshiaki Seki

Masanori Fukushima

Toshihisa Yanagisawa

The method of sucking water is capable of easily removing excess water included in a backing member adhered on a plate of a polishing apparatus. In the method, the excess water is removed from the backing member by the steps of: pressing a water absorbing member onto a holding surface of the backing member, on which the work piece is adhered and held, so as to absorb the excess water from the backing member; and sucking the excess water absorbed by the water absorbing member.

Method of sucking water and water sucking device

In the polishing system of the present invention, a adhering unit adheres a wafer on a carrying plate using liquid. A polishing unit polishes the wafer using a polishing plate. A feeding unit conveys the carrying plate from the adhering unit to the polishing unit. A dismounting unit removes the wafer from the carrying plate. A first discharging unit conveys the carrying plate from the polishing unit to the dismounting unit. A cleaning unit cleans the vacant carrying plate. A second discharging unit conveys the carrying plate from the dismounting unit to the cleaning unit. A third discharging unit conveys the carrying plate from the cleaning unit to the adhering unit. The units are formed into a loop lines so that the carrying plate is circulated in the loop line and the wafers are polished therein.

Polishing system for polishing wafer

Growing community of inventors

Nagano, Japan

Mitsue Ogawa