Dainippon Screen Mfg. Co., Ltd.

Fujitsu Corporation

Mitsuaki Yoshitani

Hiroshi Yamamoto

Kazuhiro Watanabe

Kenya Morinishi

Masahiro Miyagi

Yoshio Matsumura

Kazuo Kinose

Iwao Tanaka

Satoshi Suzuki

Yasuhiro Akita

Makoto Mori

Satoru Tanaka

Yoshihiko Matsushita

Eiichi Wada

Naoshige Itami

A substrate treating apparatus for successively treating substrates includes a body having a carrying unit for carrying the substrate along a carrying surface. The carrying surface is inclined in a plane perpendicular to the carrying direction of the substrate. The body supplies a treating liquid to the substrate being carried for treating the substrate. A receiving station is disposed upstream of the body for changing the posture of the substrate from a horizontal posture to an inclined posture corresponding to the inclination of the carrying surface, and for forwarding the substrate onto the carrying unit. In addition, a delivering station is disposed downstream of the body for returning the substrate forwarded from the carrying unit in the inclined posture to the horizontal posture.

Substrate treating apparatus and method for treating substrate

A substrate rinsing apparatus of a non-contact type having a high rinsing ability. An ultrasonic rinsing nozzle and a high-pressure rinsing nozzle are both disposed within the same rinsing apparatus. The ultrasonic rinsing nozzle ejects ultrasonic rinsing liquid as a curtain through a slit, while the high-pressure rinsing nozzle ejects a high-pressure rinsing jet toward the ultrasonic rinsing liquid which is ejected toward a substrate. Not only is foreign matter removed by ultrasonic rinsing, but foregoing matter is removed by the high-pressure rinsing jet and is carried away by a flow of the ultrasonic rinsing liquid and washed off the substrate toward a downstream side of rotation of the substrate.

Apparatus for and method of cleaning substrate

An apparatus for treating a substrate with a predetermined treatment liquid includes: a first storing portion for storing the treatment liquid; a supplying device for supplying the treatment liquid stored by the first storing device to the substrate located at a predetermined position; a receiving portion for receiving the treatment liquid supplied to the substrate after applied to the substrate; a second storing portion for storing the treatment liquid received by the receiving device; an introducing system for introducing the treatment liquid stored by the second storing portion to the first storing portion; and a controlling device for controlling the introducing system so as to prevent bubbles included in the treatment liquid stored by the second storing portion from introduction to the first storing portion.

Apparatus for and method of treating substrate

This invention is directed to a substrate treating apparatus in which a treatment is performed upon a top surface and a bottom surface of a substrate to be carried on a substrate carrying plane inclined at a certain angle to a horizontal plane in a direction normal to a substrate carrying direction. The substrate treating apparatus includes a guide plate provided below a substrate carrying plane along which a bottom surface of the substrate is to be carried; and treating liquid supply means having a first treating liquid supply member for supplying a treating liquid to a clearance defined between the bottom surface of the substrate carrying plane and the guide plate.

Substrate treating apparatus

An apparatus for removing a treating liquid from main surfaces of a substrate that has undergone a wet surface treatment, includes a transport device for transporting the substrate, a first gas jetting device having a first jet opening for jetting a gas to a first main, upper surface of the substrate transported by the transport device, and a liquid removing chamber for preventing the treating liquid removed from the main surfaces of the substrate from scattering to ambient, the liquid removing chamber having a substrate inlet and a substrate outlet. A partition is mounted in the liquid removing chamber, with an upper end thereof contacting either an upper wall, a rear wall or a front wall of the liquid removing chamber. The partition extends between opposite side walls of the chamber parallel to direction of substrate transport. The partition divides an interior space of the chamber above the first main surface of the substrate into a first space upstream of the first jet opening with respect to the direction of substrate transport, and a second space downstream of the first jet opening with respect to the direction of substrate transport.

Apparatus for removing liquid from substrates

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Hikone, Japan

Mitsuaki Yoshitani