Tokyo Electron Limited

Mitsuaki Sato

Yasuharu Sasaki

Toshiya Tsukahara

A substrate processing apparatus that includes a chamber, a substrate support disposed in the chamber, and a connection is provided. The chamber is provided with a bottom including a first flow path, and the substrate support includes a second flow path. The connection connects the first flow path to the second flow path, and the connection includes a sleeve through which the first flow path is in fluid communication with the second flow path, and a core including a first rod segment and a first elastic foam segment. The core is disposed in the sleeve, and a gap is defined between an inner surface of the sleeve and a side surface of the first rod segment.

Substrate processing apparatus

A placing table includes an edge ring disposed to surround a substrate, the edge ring having a first recess portion at a lower portion thereof; an electrostatic chuck having a first placing surface on which the substrate is placed, a second placing surface on which the edge ring is placed, and an electrode embedded therein to face the second placing surface; an annular member disposed to surround the electrostatic chuck, the annular member having a second recess portion; and an elastic member disposed in a space surrounded by the first recess portion, the electrostatic chuck and the second recess portion.

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Miyagi, Japan

Mitsuaki Sato