Nippon Kayaku Kabushiki Kaisha

Misato Oonishi

Nao Honda

Naoko Imaizumi

Shinya Inagaki

Ryo Sakai

Tadayuki Kiyoyanagi

A negative photosensitive resin composition which contains (A) an epoxy resin that has two or more epoxy groups in each molecule, (B) an alkali-soluble resin and (C) a cationic photopolymerization initiator. The epoxy resin (A) is an epoxy resin that is obtained by a reaction between a phenol derivative represented by formula (1) and an epihalohydrin. 

Negative photosensitive resin composition and cured product of same

An alkali-developing-type photosensitive resin composition comprising: a polycarboxylic acid resin (A) obtained by reacting a polybasic anhydride (c) with a reactant (ab) between a difunctional bisphenol epoxy resin (a) having an epoxy group at both terminals and an epoxy equivalent of 600-1300 g/eq., and a monocarboxylic acid compound (b) having an alcoholic hydroxyl group; an epoxy resin (B) having two or more epoxy groups in a molecule; and a photoacid generator (C), wherein the addition ratio the monocarboxylic acid compound (b) with respect to 1 equivalent of the epoxy group of the epoxy resin (a) is 80 equivalent % or more, and the addition ratio the polybasic anhydride with respect to one equivalent of the primary hydroxyl group of the reactant (ab) is 80 equivalent % or more.

Photosensitive resin composition and cured product thereof

Disclosed is a photosensitive resin composition containing a cationic photopolymerization initiator (A) and an epoxy resin (B) having two or more epoxy groups in each molecule, which is characterized in that the cationic photopolymerization initiator (A) is a cationic photopolymerization initiator (A-1) that is represented by formula (1). 

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Tokyo, Japan

Misato Oonishi