Tokyo Electron Limited

Minoru Yazawa

Masahiro Shimizu

Shigeru Kasai

Tomohiro Suzuki

A heat treatment apparatus enables a rapid temperature rise of an object to be processed while giving an excellent economical efficiency. A heating unit heats an object to be heated by irradiating a light onto the object. A plurality of lamps are provided in a lamp house. The lamps include at least one first lamp and a plurality of second lamps each having an irradiation area smaller than that of the first lamp. The lamp house has a first lamp accommodation part at a center thereof and a second lamp accommodation part surrounding the first lamp accommodation part so that the first lamp accommodation part accommodates the first lamp and the second lamp accommodation part accommodates the second lamps.

Heat treatment apparatus using a lamp for rapidly and uniformly heating a wafer

The present invention aims to exclude the influence of stray light dye to a heating lamp when measuring the temperature of an object to be treated, such as a wafer, with the use of a radiation thermometer. The present invention utilizes the relationship between a power W supplied from an output control section to lamps and optical energy radiated from the lamps . Influence which the light radiated from the lamps exerts on the output voltage of a photodiode is experimentally found beforehand as a function of the power W, and stored in a computing section . The computing section subtracts the influence of stray light from the lamps , which is included in the output voltage of the photodiode , from the output value of the photodiode on the basis of the value of the power W transmitted from the output control section , and calculates the temperature of a susceptor

Temperature measuring system

A temperature measuring method measures the temperature of a measuring object, such as a semiconductor wafer, by a radiation thermometer capable of approximating the relation between its output and the temperature of the measuring object by a predetermined straight line and of being calibrated by properly determining a slope and a y-intercept for the straight line. The measuring method carries out a procedure including the steps of measuring the reflectivity of a measuring object regarding the light of a wavelength that is not transmitted by the measuring object, and determining a slope and a y-intercept for a proper straight line for the measuring object on the basis of results of processing the measuring object by a predetermined process, such as a film forming process, that provides a result, such as the thickness of a film, corresponding to process temperature. The procedure is repeated for a plurality of measuring objects to determine the relation between the reflectivity of the measuring object, and the slope and y-intercept of the proper straight line. The radiation thermometer is calibrated on the basis of the relation, and the temperature of the measuring objects is measured.

Temperature measuring method using radiation thermometer

From a side surface of a susceptor,, in parallel with a surface of the susceptor,and directing toward a center portion, a sensor insertion hole,is bored, in this sensor insertion hole,, a temperature sensor,is fixed. A tip of a sensor insertion hole,is communicated with a heat rays guide hole,that is bored from an upper surface of the susceptor,vertical to the surface. At a junction of a sensor insertion hole,and a heat rays guide hole,, a reflector,is formed with an angle of approximately 45&deg; tilted with respect to an upper surface of a susceptor,. Heat rays radiated from a wafer W are led into a heat rays guide hole,and reflected at a reflector,to guide into a sensor insertion hole,and detect.

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Nirasaki, Japan

Minoru Yazawa