Screen Semiconductor Solutions Co., Ltd.

Minoru Sugiyama

Masahiko Harumoto

Akihiro Hisai

Akira Yamaguchi

Takuya Kuroda

Mitsuru Asano

Fumiya Okazaki

Hiroshi Yoshii

Kazuo Morioka

A slit nozzle is moved by a nozzle lifting/lowering mechanism and a nozzle sliding mechanism relative to substrates held in a substantially horizontal attitude by spin chucks. A development liquid is discharged on each substrate from a discharge port of the slit nozzle such that development processing for the substrate is performed. After the development liquid is discharged, the slit nozzle is moved to a waiting position excluding positions over the substrates held by the spin chucks. In waiting pods provided at the waiting positions, cleaning processing for the slit nozzle is performed by a cleaning liquid with gas bubbles mixed therein.

Development processing device

A cup intermediate portion and a cup lower portion surround a substrate. The cup intermediate portion is arranged above an upper surface of the cup lower portion. A sidewall surrounds the cup intermediate portion and the cup lower portion. A spacing between the upper surface of the cup lower portion and a lower surface of the cup intermediate portion gradually decreases outward from an outer peripheral portion of the substrate while a clearance is formed between the lower surface of the cup intermediate portion and the upper surface of the cup lower portion in respective outer peripheral portions of the cup intermediate portion and the cup lower portion. An inner peripheral surface of the sidewall is spaced apart from the clearance outside the clearance and surrounds the clearance.

Cup and substrate processing apparatus

A method for developing a substrate includes spinning the substrate with a spin holder and discharging a developer to the substrate from a plurality of exhaust ports arranged in a row on a developer feeder. The method also includes causing a moving mechanism to move said developer feeder in one direction extending to a center of the substrate in plan view while maintaining a direction of arrangement of said exhaust ports in said one direction, thereby to move said developer feeder between substantially the center and an edge of the substrate. The method further includes causing the developer discharged from said exhaust ports to impinge in separate streams on the substrate, and causing each of the separate streams to impinge spirally on the substrate, thereby to develop the substrate. At least two of loci of positions of impingement of the developer corresponding to said exhaust ports overlap each other.

Developing apparatus

A substrate is surrounded by an inner cup and an outer cup. A distance between an upper surface of an inner cup lower portion and a lower surface of an inner cup upper portion of the inner cup is gradually reduced outward from an outer periphery of the substrate. A clearance is formed between the upper surface of the inner cup lower portion and the lower surface of the inner cup upper portion at outer peripheries of the inner cup lower portion and the inner cup upper portion. A collection space is formed between the upper surface of the inner cup lower portion and the lower surface of the inner cup upper portion. A scatter capturing space that allows a processing liquid that has passed through the clearance to scatter and captures the scattering processing liquid is formed by an outer cup. An upper portion and an outer periphery of the scatter capturing space are covered by a lower surface and an inner side surface of the outer cup, respectively. The processing liquid that has passed through the clearance is led to the inner side surface by the lower surface of the outer cup.

Growing community of inventors

Kyoto, Japan

Minoru Sugiyama