Global Unichip Corporation

Taiwan Semiconductor Manufacturing Comp. Ltd.

National Taiwan University

Ming-Tung Chang

Min-Hsiu Tsai

Chih-Mou Tseng

Chien-Mo Li

Jen-Yang Wen

A through-silicon via (TSV) testing structure is disclosed herein and includes a plurality of controllers, a plurality of transmitters and a plurality of receivers. The controllers are configured to output a first controlling signal and a second controlling signal. The transmitters are respectively connected to the output end of the through-silicon via and one of the controllers, and output a testing output signal in accordance with the first controlling signal and the second controlling signal. The receivers are respectively connected to the input end of the through-silicon via and another one of the controllers, and input a testing input signal in accordance with the first controlling signal and the second controlling signal.

Through silicon via testing structure

In a method for creating a clock domain in a layout of an integrated circuit, a test circuit of the integrated circuit includes a plurality of first scan cells and a plurality of second scan cells, the first scan cells are arranged to be on a first scan chain, and the second scan cells are arranged to be on a second scan chain. The method includes: for a first region in the layout, determining whether the first region needs a test clock domain adjustment according to densities of first scan cells and second scan cells within the first region; and when it is determined that the first region needs the test clock domain adjustment, arranging at least one first scan cell within the first region to be on the second scan chain.

Method for creating test clock domain during integrated circuit design, and associated computer readable medium

Growing community of inventors

Hsinchu County, Taiwan

Ming-Tung Chang