Taiwan Semiconductor Manufacturing Comp. Ltd.

Ming-Ching Chang

Chao-Cheng Chen

Chih-Han Lin

Shih-Yao Lin

Shu-Yuan Ku

Ryan Chia-Jen Chen

Kuei-Yu Kao

Chen-Ping Chen

Jr-Jung Lin

Chun-Hung Lee

Yi-Hsuan Hsiao

Chih-Chang Hung

I-Wei Yang

Tzu-Yen Hsieh

De-Fang Chen

Yu Chao Lin

Hsiao Wen Lee

Yih-Ann Lin

Syun-Ming Jang Jang

Huan-Just Lin

Ya-Yi Tsai

Chih-Chung Chiu

Teng-Chun Tsai

Chia-Jen Chen

Li-Ting Wang

Yi-Chun Chen

Cheng-Tung Lin

Yu-Hsien Lin

Yuan-Sheng Huang

Cheng-Chung Chang

Li-Wei Yin

Shao-Hua Hsu

Tzu-Wen Pan

Shiang-Bau Wang

Jin-Aun Ng

Jih-Jse Lin

Hun-Jan Tao

Li-Te S Lin

Chang-Yun Chang

Chia-Wei Chang

Tzu-Chung Wang

Hsin-Yi Tsai

Ryan Chia-jen Chen

Yu-Shan Cheng

Dai-Lin Wu

Li-Jung Kuo

Chen-Yui Yang

Ke-Chia Tseng

Chi On Chui

Tze-Liang Lee

Bao-Ru Young

Tai-Chun Huang

Chia-Hao Yu

Chan-Lon Yang

Chunyao Wang

Ming-Jie Huang

Fang-Cheng Chen

Ming-Chia Tai

Chieh-Ning Feng

Chun-Liang Lai

Hsien-Chung Huang

Wei-Liang Lu

Yuan-Ming Chiu

I-Yin Lu

Anthony Yen

Shinn-Sheng Yu

Ming-Feng Shieh

Jeff J Xu

Yuan-Hung Chiu

Bing-Hung Chen

Chi-Sheng Lai

Wei-Chung Sun

Li-Shiun Chen

Hsiaowen Lee

Jui-Ming Chen

Yui Wang

Yuan-Min Chiu

Li-Shung Chen

Huain-Jelin Lin

Yuan-Hong Chin

Hong-Yuan Tao

Yung-Hog Chiu

A semiconductor device and method of forming thereof includes a first fin and a second fin each extending from a substrate. A first gate segment is disposed over the first channel and a second gate segment is disposed over the second channel. An interlayer dielectric (ILD) layer is adjacent the first gate segment and the second gate segment. A cut region (e.g., opening or gap between first gate structure and the second gate structure) extends between the first and second gate segments. The cut region has a first portion has a first width and a second portion has a second width, the second width is greater than the first width. The second portion interposes the first and second gate segments and the first portion is defined within the ILD layer.

Metal gate structure and methods of fabricating thereof

Provided are devices with replacement structures and methods for fabricating such structures. A method includes forming a layer over a semiconductor material having a top surface in a horizontal plane; forming a dummy structure over the layer, wherein the dummy structure has sidewall, wherein the dummy structure lies directly over a first region of the layer and over a first region of the semiconductor material under the first region of the layer, and wherein the dummy structure does not lie directly over a second region of the layer or over a second region of the semiconductor material under the second region of the layer, and removing the second region of the layer and forming a side edge of the first region of the layer, wherein the side edge forms an angle of from 90 to 100 degrees with the horizontal plane.

Replacement structures

A semiconductor device includes a fin extending from a substrate, a gate stack over and along a sidewall of the fin, a spacer along a first sidewall of the gate stack and the sidewall of the fin, a dummy gate material along the sidewall of the fin, wherein the dummy gate material is between the spacer and the gate stack, and a first epitaxial source/drain region in the fin and adjacent the gate stack.

FinFET device and method

A method for fabricating a semiconductor device is provided. The method includes forming a fin structure extending along a first lateral direction; forming a dummy gate structure that is over a portion of the fin structure and extends along a second direction perpendicular to the first lateral direction; growing source/drain structures that are respectively coupled to ends of the portion of the fin structure; removing the dummy gate structure to form a gate trench; lining inner sidewalls of the gate trench with a gate spacer; and forming an active gate structure in the gate trench.

Gate structures and spacers in semiconductor devices and methods of manufacturing thereof

In a method of manufacturing a semiconductor device, a fin structure in which first semiconductor layers and second semiconductor layers are alternately stacked over a bottom fin structure protruding from a substrate, is formed. A sacrificial gate structure is formed over the fin structure. A source/drain region of the fin structure is etched, thereby forming a source/drain space. The first semiconductor layers are laterally etched through the source/drain space. An inner spacer is formed on an end of each of the etched first semiconductor layers. One or more epitaxial layers are formed in the source/drain space, and the sacrificial gate structure is replaced with a metal gate structure. A width of the source/drain space at a bottommost one of the first semiconductor layers is greater than a width of the source/drain space at one of the first semiconductor layers above the bottommost one of the first semiconductor layers.

Method of manufacturing a semiconductor device and a semiconductor device

A semiconductor device in a first area includes first non-planar semiconductor structures separated with a first distance, and a first isolation region including a first layer and a second layer that collectively embed a lower portion of each of the first non-planar semiconductor structures. At least one of the first layer or second layer of the first isolation region is in a cured state. The semiconductor device in a second area includes second non-planar semiconductor structures separated with a second distance, and a second isolation region including a first layer and a second layer that collectively embed a lower portion of each of the second non-planar semiconductor structures. At least one of the first or second layer of the second isolation region is in a cured state.

Semiconductor devices and methods of manufacturing thereof

Metal gate cutting techniques for fin-like field effect transistors (FinFETs) are disclosed herein. An exemplary method includes receiving an integrated circuit (IC) device structure that includes a substrate, one or more fins disposed over the substrate, a plurality of gate structures disposed over the fins, a dielectric layer disposed between and adjacent to the gate structures, and a patterning layer disposed over the gate structures. The gate structures traverses the fins and includes first and second gate structures. The method further includes: forming an opening in the patterning layer to expose a portion of the first gate structure, a portion of the second gate structure, and a portion of the dielectric layer; and removing the exposed portion of the first gate structure, the exposed portion of the second gate structure, and the exposed portion of the dielectric layer.

Residue-free metal gate cutting for fin-like field effect transistor

A semiconductor device includes a substrate. The semiconductor device includes a fin that is formed over the substrate and extends along a first direction. The semiconductor device includes a gate structure that straddles the fin and extends along a second direction perpendicular to the first direction. The semiconductor device includes a first source/drain structure coupled to a first end of the fin along the first direction. The gate structure includes a first portion protruding toward the first source/drain structure along the first direction. A tip edge of the first protruded portion is vertically above a bottom surface of the gate structure.

According to an exemplary embodiment, a method of forming a vertical device is provided. The method includes: providing a protrusion over a substrate; forming an etch stop layer over the protrusion; laterally etching a sidewall of the etch stop layer; forming an insulating layer over the etch stop layer; forming a film layer over the insulating layer and the etch stop layer; performing chemical mechanical polishing on the film layer and exposing the etch stop layer; etching a portion of the etch stop layer to expose a top surface of the protrusion; forming an oxide layer over the protrusion and the film layer; and performing chemical mechanical polishing on the oxide layer and exposing the film layer.

Vertical device having a protrusion source

A semiconductor device includes a first plurality of channel layers. The first plurality of channel layers extend along a first direction. The semiconductor device includes a second plurality of channel layers. The second plurality of channel layers also extend along the first direction. The semiconductor de123329-vice includes a first dielectric fin structure that also extends along the first direction. The semiconductor device includes a first gate structure that extends along a second direction. The first gate structure comprises a first portion that wraps around each of the first plurality of channel layers and a second portion that wraps around each of the second plurality of channel layers. The first dielectric fin structure separates the first and second portions from each other. The first gate structure comprises a third portion that connects the first and second portions to each other and is vertically disposed below the first dielectric fin structure.

A semiconductor device includes a plurality of first channel layers vertically spaced from one another and a plurality of second channel layers vertically spaced form one another. Each of the plurality of first and second channel layers extend along a first lateral direction. The semiconductor device includes an isolation structure disposed between the plurality of first channel layers and the plurality of second channel layers along a second lateral direction perpendicular to the first lateral direction. The semiconductor device includes a plurality of inner spacers discretely disposed along a first sidewall of the isolation structure that faces toward the first lateral direction, or discretely disposed along a second sidewall of the isolation structure that faces away from the first lateral direction wherein an interface between each of the plurality of inner spacers and the first or second sidewall has a vertical profile.

A method incudes forming first and second semiconductor fins upwardly extending from a substrate; forming a gate strip extending across the first and second semiconductor fins; growing first source/drain regions on the first semiconductor fin and at opposite sides of the gate strip, second source/drain regions on the second semiconductor fin and at opposite sides of the gate strip; depositing a dielectric layer over the first and second source/drain regions; forming an isolation material in the dielectric layer and between one of the first source/drain regions and one of the second source/drain regions; performing an etching process on the isolation material and the gate strip to form an opening, the opening breaking the grid strip and recessing the isolation material; forming a separation material in the opening.

Method for fabricating semiconductor structure with cutting depth control

A method of forming a semiconductor device includes: forming a fin protruding above a substrate; forming isolation regions on opposing sides of the fin; forming a dummy gate electrode over the fin; removing lower portions of the dummy gate electrode proximate to the isolation regions, where after removing the lower portions, there is a gap between the isolation regions and a lower surface of the dummy gate electrode facing the isolation regions; filling the gap with a gate fill material; after filling the gap, forming gate spacers along sidewalls of the dummy gate electrode and along sidewalls of the gate fill material; and replacing the dummy gate electrode and the gate fill material with a metal.

Fin field-effect transistor device and method of forming the same

A semiconductor device includes a substrate. The semiconductor device includes a dielectric fin that is formed over the substrate and extends along a first direction. The semiconductor device includes a gate isolation structure vertically disposed above the dielectric fin. The semiconductor device includes a gate structure extending along a second direction perpendicular to the first direction. The gate structure includes a first portion and a second portion separated by the gate isolation structure and the dielectric fin. The first portion of the gate structure presents a first beak profile and the second portion of the gate structure presents a second beak profile. The first and second beak profiles point toward each other.

A device includes a fin protruding from a semiconductor substrate; a gate stack over and along a sidewall of the fin; a gate spacer along a sidewall of the gate stack and along the sidewall of the fin; an epitaxial source/drain region in the fin and adjacent the gate spacer; and a corner spacer between the gate stack and the gate spacer, wherein the corner spacer extends along the sidewall of the fin, wherein a first region between the gate stack and the sidewall of the fin is free of the corner spacer, wherein a second region between the gate stack and the gate spacer is free of the corner spacer.

Method of manufacturing a semiconductor device having corner spacers adjacent a fin sidewall

Growing community of inventors

Hsinchu, Taiwan

Ming-Ching Chang