Uwiz Technology Co., Ltd.

Ming Che Ho

Ming Hui Lu

Song Yuan Chang

Wen Cheng Liu

Yun Lung Ho

Yi Han Yang

Chun Chieh Lee

A chemical mechanical polishing slurry for polishing a stainless steel substrate is provided, which comprises a content 10&#x2dc;50 wt % of abrasive particles, a content 0.001&#x2dc;2.0 wt % of a coolant, a content 0.001&#x2dc;1.0 wt % of an oxidant, a content 10&#x2dc;5000 ppm of a lubricity improver, and a content 10&#x2dc;5000 ppm of a foam inhibitor. A particle size of the abrasive particles is in a range of 20&#x2dc;500 nm. The alkaline polishing slurry according to the present invention is capable of increasing the polishing performance, surface quality, and surface passivation effect after the chemical-mechanical polishing process.

Chemical mechanical polishing slurry

A polishing composition comprising abrasive particles, a compound having hexavalent molybdenum or pentavalent vanadium, an anionic additive, a halogen oxides compound or salts thereof, and a carrier solvent is provided herein. The polishing composition is suitable for chemical mechanical polishing process of SiGe, Si and SiOsubstrates. The compound having hexavalent molybdenum or pentavalent can effectively raise the removal rate for SiGe and Si substrates, and increase the polishing selectivity of SiGe and Si relative to SiO, simultaneously.

Polishing composition

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Taoyuan, Taiwan

Ming Che Ho