Asm Japan K.k.

Nhk Spring Co., Ltd.

Mikio Shimizu

Kiyoshi Sato

Toshihiko Hanamachi

Shinya Miyaji

Akira Shimizu

Yukihiro Mori

Kiyoshi Satoh

A batch-processing type semiconductor-manufacturing device includes a cylindrical reaction chamber with its upper end closed and its bottom end open, a substrate-supporting boat loading multiple substrates, which are inserted within the reaction chamber, and an injector for spraying a reaction gas to the substrates, which injector is provided parallel to the substrate-supporting boat within the reaction chamber. The injector is supported by an injector holder, and both the injector and the injector holder are fitted by a male-female fitting structure.

Semiconductor-manufacturing device

A substrate-holding apparatus for holding a semiconductor substrate in a semiconductor processor is characterized in that the apparatus includes a mount block made of an aluminum alloy wrought product and having a mount surface for mounting a semiconductor thereon, a heating block with a heater body embedded therein for heating the semiconductor substrate, and a shield member made of an aluminum alloy wrought product for housing the heating block. The mount plate is securely attached to the heating block by brazing or with bolts.

Substrate holding apparatus for processing semiconductors

A substrate-holding apparatus for holding a semiconductor substrate in a semiconductor processor is characterized in that the apparatus includes a mount block made of, e.g., aluminum nitrate with a high-frequency electrode embedded therein and a heating block made of, e.g., an aluminum alloy with a heating body embedded therein. The mount block is tightly attached to the heating block by engaging the bottom surface of the mount block with the top surface of the heating block, for example, by using a latching mechanism.

Substrate holding apparatus for processing semiconductor

A supporting structure of a susceptor for semiconductor processing includes: (a) a plate having a carrying surface for placing a semiconductor substrate thereon, which plate has a back surface having a first coupling structure with a first pawl; and (b) a heating block for heating the semiconductor substrate, which heating block has an upper surface in contact with the back surface of the plate. The upper surface has a second coupling structure with a second pawl corresponding to the first coupling structure with the first pawl. A coupler may be used for placing the first pawl and the second pawl in pressure contact to couple the plate and the heating block.

Growing community of inventors

Tama, Japan

Mikio Shimizu