Ontrak Systems, Inc.

Lam Research Corporation

Mikhail Ravkin

Diane J Hymes

Venus Noorai

Wibur C Krusell

John Martin De Larios

Douglas Grant Gardner

A cleaning method and apparatus using very dilute Standard Clean 1 (SC1) for cleaning semiconductor substrates, including silicon wafers. The SC1 is delivered to the core of a brush where the solution is absorbed by the brush and then applied by the brush onto the substrate. This delivery system applies the chemical solutions uniformly to the semiconductor substrate and reduces the volumes of chemical solutions used in a scrubbing process. The process of the present invention uses SC1 to convert substrate surfaces from a hydrophobic state to a hydrophilic surface state while cleaning the wafer with the brush. A hydrophilic surface state is necessary to successfully remove surface contaminants by chemical mechanical brush cleaning.

Apparatus for cleaning semiconductor substrates

Method and apparatus for cleaning of semiconductor substrates using

A Method and Apparatus for Chemical Delivery Through the Brush used in semiconductor substrate cleaning processes. The chemical solutions are delivered to the core of a brush where the solution is absorbed by the brush and then applied by the brush onto the substrate. This delivery system applies the chemical solutions uniformly to the semiconductor substrate, reduces the volumes of chemical solutions used in a scrubbing process, and helps maintain control of the pH profile of a substrate. This system is described and illustrated in the manner it is used in conjunction with a scrubber that scrubs both sides of a semiconductor substrate.

Apparatus for a brush assembly

Growing community of inventors

Sunnyvale, CA, United States of America

Mikhail Ravkin