Other

Michael Thomas Tucker

Terry Alan Breeden

Karl Emerson Mautz

Stefan Ottow

Ralf Zedlitz

Iraj Eric Shahvandi

Dan Wissel

Wolfram K&ouml;stler

Olivier Gerard Marc Vatel

A recycling procedure for 300 mm nitride dummy wafers which have a stabilization layer of silicon dioxide is provided. The recycling procedure is essentially based on selectively wet etching the deposited silicon nitride with respect to the silicon dioxide stabilization layer, preferably with hot phosphoric acid at 160&deg; C. In particular, a method of handling a silicon wafer which is employed as a dummy wafer during a nitride deposition process includes the steps of depositing a silicon dioxide layer on the wafer surface, performing the nitride deposition process on the wafer to deposit silicon nitride or silicon oxinitride on the wafer surface until a predetermined layer thickness is reached, and etching the silicon nitride or silicon oxinitride layer selectively with respect to the silicon dioxide layer.

Method of handling a silicon wafer

In a CVD chamber ( ) having a chuck ( ) to hold a semiconductor substrate ( ) and having a plasma generator ( ) to generate a plasma ( ), a trench in the substrate is filled with dielectric material from ions ( ) of the plasma. The ions are forced to move in a direction ( ) that is substantially perpendicular to the surface of the substrate by a pulsed unidirectional voltage between the plasma generator and the substrate, by a circular magnetic field, or by a combination of both fields.

Plasma-enhanced chemical vapor deposition (CVD) method to fill a trench in a semiconductor substrate

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Dallas, TX, United States of America

Michael Thomas Tucker