Lam Research Corporation

Michael Philip Roberts

Ramesh Chandrasekharan

Adrien Lavoie

Pulkit Agarwal

Ravi Kumar

Chloe Baldasseroni

Aaron Bingham

Ashish Saurabh

Ishtak Karim

Paul Konkola

Patrick G Breiling

Joseph Abel

Jennifer Leigh Petraglia

Michael G R Smith

Douglas Walter Agnew

Richard Phillips

Eric Russell Madsen

Brian Joseph Williams

Chan Myae Myae Soe

Eli Jeon

Daniel Boatright

Nuoya Yang

William Laurence McDaniel

Arun Anandhan Duraisamy

The present disclosure relates to a system for a semiconductor processing. The system includes a semiconductor processing chamber having a plurality of processing stations, a plurality of manifold trunks, a plurality of valves, and a plurality of fluid manifolds. Each manifold trunk includes an outlet, a common flowpath, a plurality of trunk inlets, a plurality of orifices, and a plurality of valve interfaces.

Apparatuses for uniform fluid delivery in a multi-station semiconductor processing chamber

A substrate processing system includes a processing chamber, a substrate support including a plurality of heater zones arranged in the processing chamber, a gas delivery system configured to deliver process gases to the processing chamber, and a controller configured to communicate with the gas delivery system and the plurality of heater zones, initiate a first treatment step of a process during a transient temperature period after a substrate is arranged on the substrate support and prior to the substrate reaching a steady-state temperature of the substrate support, and adjust heating to each of the plurality of heater zones during the first treatment step based on average heat functions determined for corresponding ones of the plurality of heater zones during a period corresponding to the first treatment step.

Rapid tuning of critical dimension non-uniformity by modulating temperature transients of multi-zone substrate supports

A system to process a semiconductor substrate includes a substrate support assembly configured to support the semiconductor substrate. The substrate support assembly includes M resistive heaters respectively arranged in M zones in a layer of the substrate support assembly, where M is an integer greater than 1. The layer is adjacent to the semiconductor substrate. The substrate support assembly includes N temperature sensors arranged at N locations in the layer, where N is an integer greater than 1 and less than or equal to M. The system further includes a controller configured to control one or more of the M resistive heaters based on a temperature sensed by one of the N temperature sensors and average temperatures of one or more of the M zones.

Temperature control of a multi-zone pedestal

A method for evacuating a volume below a substrate in a substrate processing system includes arranging the substrate on a lift mechanism of a substrate support to define the volume below the substrate between the substrate and an upper surface of the substrate support. An evacuation step is initiated to evacuate the volume below the substrate. The evacuation step includes pumping down the volume below the substrate at least one of through and around the lift mechanism. The lift mechanism is lowered during the evacuation step to position the substrate on the upper surface of the substrate support and the evacuation step is terminated.

Use of vacuum during transfer of substrates

Apparatuses and systems for pedestals are provided. An example pedestal may have a body with an upper annular seal surface that is planar, perpendicular to a vertical center axis of the body, and has a radial thickness, a lower recess surface offset from the upper annular seal surface, and a plurality of micro-contact areas (MCAs) protruding from the lower recess surface, each MCA having a top surface offset from the lower recess surface by a second distance less, and one or more electrodes within the body. The upper annular seal surface may be configured to support an outer edge of a semiconductor substrate when the semiconductor substrate is being supported by the pedestal, and the upper annular seal surface and the tops of the MCAs may be configured to support the semiconductor substrate when the semiconductor substrate is being supported by the pedestal.

Electrostatic chuck with seal surface

A system to deposit a film on a substrate using atomic layer deposition includes a pedestal arranged in a processing chamber to support the substrate on a top surface of the pedestal when depositing the film on the substrate. A first annular recess in the pedestal extends downwardly from the top surface of the pedestal and radially inwardly from an outer edge of the pedestal towards an outer edge of the substrate. The first annular recess has an inner diameter that is greater than a diameter of the substrate. An annular ring is made of a dielectric material and is arranged around the substrate in the first annular recess. A second annular recess in the pedestal is located under the annular ring. The second annular recess has a height and extends radially inwardly from the outer edge of the pedestal towards the outer edge of the substrate.

Pedestals for modulating film properties in atomic layer deposition (ALD) substrate processing chambers

A substrate processing system is provided and includes a substrate support, a memory, and calibration, operating parameter, and solving modules. The substrate support supports a substrate and includes temperature control elements. The memory stores, for the temperature control elements, temperature calibration values and sensitivity calibration values. The calibration module, during calibration of the temperature control elements, performs a first calibration process to determine the temperature calibration values or a second calibration process to determine the sensitivity calibration values. The sensitivity calibration values relate at least one of trim amounts or deposition amounts to temperature changes. The operating parameter module determines operating parameters for the temperature control elements based on the temperature and sensitivity calibration values. The solving module, subsequent to the calibration of the temperature control elements, controls operation of the temperature control elements during at least one of a trim or deposition step based on the operating parameters.

Trim and deposition profile control with multi-zone heated substrate support for multi-patterning processes

A showerhead utilized within a process chamber includes a first inlet for receiving a first gas from a first source at a center region of an inner plenum defined therein. A plurality of second inlets is defined along a peripheral region of the showerhead for receiving a second gas from a second source. A plurality of conduits couples the edge plenum to an outer edge of the inner plenum so as to supply the second gas to the inner plenum. The first gas creates an inner flow that flows radially outward from the center region to an outer edge of the inner plenum and the second gas supplied by the edge plenum creates a perimeter flow that flows inward from the outer edge of the inner plenum toward the center region. A stagnation point defining an adjustable radius is formed at an interface of the first gas and the second gas. A plurality of outlets are defined across a lower surface of the showerhead and extends a diameter of the inner plenum such that the first gas from the inner flow exits the plurality of outlets from the center region up to the stagnation point and the second gas from the perimeter flow exits the plurality of outlets from the stagnation point to the outer edge.

Dual gas feed showerhead for deposition

A substrate processing system configured to perform a deposition process on a substrate includes a substrate support including a plurality of zones and a plurality of resistive heaters arranged throughout the plurality of zones. The plurality of resistive heaters includes separately-controllable resistive heaters arranged in respective ones of the plurality of zones. A controller is configured to, during the deposition process, control the plurality of resistive heaters to selectively adjust temperatures within the plurality of zones.

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Tigard, OR, United States of America

Michael Philip Roberts