Tokyo Electron Limited

Toyko Electron Limited

Michael Murphy

Daniel J Fulford

Charlotte Cutler

Anton J deVillers

Jodi Grzeskowiak

David C Conklin

Andrew Weloth

Steven Gueci

Jeffrey Smith

Anthony R Schepis

David Conklin

In method of patterning a substrate, a first relief pattern is formed based on a first layer deposited over a substrate. Openings in the first relief pattern are filled with a reversal material. The first relief pattern is then removed from the substrate and the reversal material remains on the substrate to define a second relief pattern. A fill material is deposited over the substrate that is in contact with the second relief pattern, and sensitive to a photo-acid generated from a photo-acid generator in the second relief pattern. Selected portions of the second relief pattern are exposed to a first actinic radiation to generate the photo-acid in the selected portions of the second relief pattern. The photo-acid are driven from the selected portions of the second relief pattern into portions of the fill material so that the portions of the fill material to become soluble to a predetermined developer.

Method to form narrow slot contacts

Techniques herein include methods of patterning a substrate using surface energy differences found in some fluorinated polymers or polymers with long chain alkyl functionality that promotes surface or top layer segregation in a bilayer polymer system to facilitate overburden removal when the polymer mixture is deposited over a relief pattern. The method allows for fast removal of the overburden to expose the anti-spacer region which, after acid diffusion and subsequent deprotection, is also soluble in a developer. Incorporating the highly developer-soluble polymer at the top of the top layer removes the need for the remaining polymer to have a specific dissolution rate in developer.

Method for removing material overburden via enhanced freeze-less anti-spacer formation using a bilayer system

In certain embodiments, a method includes forming, by photolithography on a semiconductor wafer, first patterned features (PFs) including first photoresist structures (PRSs) having a first width and first recesses having a second width less than the first width and greater than a target width; forming, via anti-spacer patterning processing, second PFs including second PRSs having a third width less than the first width, first overcoat structures (OCSs) of the second width interspersed between second PRSs, and second recesses having a fourth width less than the target width; and forming, via acid diffusion processing, third PFs including third PRSs having a fifth width, second OCSs of the target width interspersed between third PRSs, and third recesses defined by third PRSs and second OCSs and having a sixth width greater than the fourth width, portions of first OCSs having been selectively removed using the acid diffusion processing to form second OCSs.

Patterning semiconductor features

Techniques herein include methods for coating a single layer actuator film or multi-layer actuator film on the backside of a wafer. The actuator film includes one or more chemical actuators. Chemical actuators are various molecules, crystals, chemical compounds and other chemical compositions that are capable of imposing directional stress in response to application of an external stimulus on the chemical actuator. The external stimulus can include a particular wavelength of light or polarization of light, or heat (or directed infrared radiation) or load, which can include load-responsive actuation or pressure-responsive actuation.

Method of adjusting wafer shape using multi-directional actuation films

Aspects of the present disclosure provide a wafer processing device for optimizing wafer shape. For example, the wafer processing device can include a first hot plate, a second hot plate and a controller. The first hot plate can be configured to heat a wafer. For example, the first hot plate can provide uniform heating across a surface of the first hot plate. The second hot plate has multiple heating zones with each heating zone independently controllable such that each heating zone can be set to a temperature value independent of other heating zones. The controller is configured to control the first hot plate to provide the uniform heating, receive a bow measurement from wafer curvature measurement of a wafer, and set the multiple heating zones of the second hot plate to their respective temperature values that correspond to the bow measurement.

In-situ lithography pattern enhancement with localized stress treatment tuning using heat zones

Process flows and methods are provided for recessing a fill material within openings formed within a patterned substrate. The openings are formed within a multilayer stack comprising a target material layer and one or more additional material layers, which overly and differ from the target material layer. After the openings are formed within the multilayer stack, a grafting material comprising a solubility-shifting agent is selectively deposited within the openings, such that the grafting material adheres to the target material layer without adhering to the additional material layer(s) overlying the target material layer. Next, a fill material is deposited within the openings and the solubility-shifting agent is activated to change the solubility of a portion of the fill material adjacent to and surrounding the grafting material. Then, a wet development process is used to remove the soluble/insoluble portions of fill material to the recess the fill material within the openings.

Method for recessing a fill material within openings formed on a patterned substrate

A method of patterning a substrate includes depositing an overcoat in openings of a relief pattern. The relief pattern includes a solubility-shifting agent and a deprotectable monomer sensitive to the solubility-shifting agent. The overcoat includes another deprotectable monomer sensitive to the solubility-shifting agent. The overcoat has a solubility threshold relative to a predetermined developer that is lower than the solubility threshold of the relief pattern relative to the developer. The method includes activating the solubility-shifting agent to at least reach the solubility threshold of the overcoat without reaching the solubility threshold of the relief pattern, diffusing the solubility-shifting agent a predetermined distance from structures of the relief pattern into the overcoat to form soluble regions in the overcoat, and developing the substrate with the developer to remove the soluble regions of the overcoat. The soluble regions are soluble in the developer while the relief pattern remains insoluble in the developer.

Freeze-less methods for self-aligned double patterning

In certain embodiments, a method for processing a semiconductor substrate includes depositing a resin film on a substrate that has microfabricated structures defining recesses. The resin film fills the recesses and covers the microfabricated structures. The method includes performing, using a photoacid generator (PAG)-based process, a localized removal of the resin film to remove the resin film to respective first depths in the recesses, at least two depths of the respective first depths being different depths. The method includes repeatedly performing, using a thermal acid generator (TAG)-based process and until a predetermined condition is met, a uniform removal of a remaining portion of the resin film to remove a substantially uniform depth of the resin film in the recesses.

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Albany, NY, United States of America

Michael Murphy