Sandisk Technologies Inc.

Hgst Netherlands, B.v.

Western Digital Technologies, Inc.

Hitachi Global Storage Technologies Netherlands B.v.

Hitachi Global Technologies Netherlands B.v.

Hsgt Netherlands B.v.

Michael Grobis

Ward M Parkinson

Michael Nicolas Albert Tran

Nathan Franklin

Neil Leslie Robertson

Bruce David Terris

Manfred Ernst Schabes

Derek Stewart

Barry C Stipe

James E O'Toole

Ricardo Ruiz

Daniel Bedau

Zhaoqiang Bai

Kurt A Rubin

Gerardo Bertero

Mac D Apodaca

Hans Juergen Richter

Goran Mihajlovic

Thomas R Albrecht

Christopher John Petti

Erhard Theodor Schreck

Jeffrey Scott Lille

Raj K Ramanujan

Dieter Klaus Weller

Hal Jervis Rosen

Ernesto Esteban Marinero

Olav Hellwig

Dan Saylor Kercher

Hans Jurgen Richter

James W Reiner

Richard Leo Galbraith

Toshiki Hirano

Neil Smith

Martin Aureliano Hassner

Bruno Jean Marchon

Lidu Huang

Dimitri Houssameddine

Tetsuo Semba

Pierre-Olivier Jubert

Roger William Wood

Kentaro Takano

Thomas Michael Trent

Abhishek Dhanda

Qing Zhu

John C Read

Juan Pablo Saenz

Shen Ren

Liesl Folks

Gabriel Zeltzer

Sripathi Vangipuram Canchi

Tiffany Santos

Joyeeta Nag

Gregory John Parker

Andrew Thomas McCallum

Michael Tran

Virat Vasav Mehta

Sung Hun Wee

Gerrit Jan Hemink

Technology is disclosed herein for reading programmable resistance memory cells. A first (faster) self-referenced read (SRR) of a group of memory cells is performed and if successful the read is complete. However, if the first SRR fails then a second (slower or nominal) SRR is performed. The bit error rate (BER) of the second SRR may be significantly lower than the BER of the first SRR. However, the BER of the first SRR may be low enough such that most of the time the first SRR is successful. Therefore, most of the time the read is completed with just the first SRR, thereby providing for an SRR having on average is faster than if just the second SRR had been used. Moreover, the effective BER of the SRR is extremely low due to the low BER of the second SRR.

Fast self-referenced read of programmable resistance memory cells

Technology is disclosed herein for refreshing threshold switching selectors in programmable resistance memory cells in cross-point memory arrays. The Vt of the threshold switching selector may drift over time. The memory system resets the Vt of the threshold switching selectors with a selector refresh operation and uses a separate data refresh operation to refresh data in programmable resistance memory elements. The data refresh operation itself may also refresh the selector. However, the threshold switching selector refresh operation is faster than the data refresh operation. Moreover, the selector refresh operation consumes much less power and/or current then the data refresh operation. The selector refresh operation may thus be performed at a higher rate than the data refresh operation.

Cross-point array refresh scheme

Concurrent access of multiple memory cells in a cross-point memory array is disclosed. In one aspect, a forced current approach is used in which, while a select voltage is applied to a selected bit line, an access current is driven separately through each selected word line to concurrently drive the access current separately through each selected memory cell. Hence, multiple memory cells are concurrently accessed. In some aspects, the memory cells are accessed using a self-referenced read (SRR), which improves read margin. Concurrently accessing more than one memory cell in a cross-point memory array improves bandwidth. Moreover, such concurrent accessing allows the memory system to be constructed with fewer, but larger cross-point arrays, which increases array efficiency. Moreover, concurrent access as disclosed herein is compatible with memory cells such as MRAM which require bipolar operation.

Concurrent multi-bit self-referenced read of programmable resistance memory cells in cross-point array

Concurrent write to programmable resistance memory cells in cross-point array

A method is provided that includes reading a plurality of resistance-switching memory cells comprising a block of data, decoding the block of data using an error correction code decoder, and based on results of the decoding, selectively performing an overwrite-read process to read the block of data. The overwrite read process determines a change in resistance of the resistance-switching memory cells in response to a write pulse.

Overwrite read methods for resistance switching memory devices

Technology for read in a cross-point memory array. Drive transistors pass read and write currents to the cross-point memory array. The read current charges a selected word line to turn on a threshold switching selector of a selected memory cell. While the threshold switching selector is on, the current (read or write) passes through the selected memory cell. The memory system applies a smaller overdrive voltage to a drive transistor when the drive transistor is passing the read current than when the drive transistor is passing the write current. A smaller overdrive voltage increases the resistance of the drive transistor. Increasing the resistance of the drive transistor increases the resistance seen by the threshold switching selector in the selected memory cell, which reduces the Ihold of the threshold switching selector.

Cross-point array IHOLD read margin improvement

An MRAM-based vector multiplication device, such as can be used for inferencing in a neural network, is presented that is ultralow power, low cost, and does not require special on-chip programming. A crosspoint array has an MRAM cell at each crosspoint junction and periphery array circuitry capable of supplying independent input voltages to each word line and reading current on each bit line. Vector multiplication is performed as an in-array multiplication of a vector of input voltages with matrix weight values encoded by the MRAM cell states. The MRAM cells can be individually programmed using a combination of input voltages and an external magnetic field. The external magnetic field is chosen so that a write voltage of one polarity reduces the anisotropy sufficiently to align the cell state with the external field, but is insufficient to align the cell if only half of the write voltage is applied.

Ultralow power inference engine with external magnetic field programming assistance

Technology is disclosed for a memory system having a cross-point array with threshold switching selector memory cells. Each memory cell has a two-terminal threshold switching selector memory element that may be programmed to two different on-state conductances in order to store information. One bit value may be represented by a high-resistance state (HRS) when in the on-state and another bit value may be represented by a low-resistance state (LRS) when in the on-state. In one aspect, a conditioning signal is applied to the memory cell prior to programming. Applying a program signal with the opposite polarity as the conditioning signal may result in a higher conductance in the on-state than applying a program signal with the same polarity as the conditioning signal. The memory element may also serve as a selector for the memory cell. The memory element may include an Ovonic Threshold Switch (OTS).

Cross-point array with threshold switching selector memory element

Technology for reading reversible resistivity cells in a memory array when using a current-force read is disclosed. The memory cells are first read using a current-force referenced read. If the current-force referenced read is successful, then results of the current-force referenced read are returned. If the current-force referenced read is unsuccessful, then a current-force self-referenced read (SRR) is performed and results of the current-force SRR are returned. In an aspect this mixed current-force read is used for MRAM cells, which are especially challenging to read.

Mixed current-forced read scheme for MRAM array with selector

Technology is disclosed for a fast ECC engine for a mixed read of MRAM cells. A codeword read from MRAM cells using a referenced read is decoded using a first ECC mode. If decoding passes, results are provided to a host. If decoding fails, a self-referenced read (SRR) is performed. The data read using the SRR is decoded with a second ECC mode that is capable of correcting a greater number of bits than the first ECC mode. The second ECC mode may have a higher mis-correction rate than the first ECC mode (for a given raw bit error rate (RBER)). However, the RBER may be lower when using the second ECC mode. Therefore, the first and second ECC modes may result in about the same probability of an undetectable error (or mis-correction).

Programmable ECC for MRAM mixed-read scheme

In a memory array with a cross-point structure, at each cross-point junction a programmable resistive memory element, such as an MRAM memory cell, is connected in series with a threshold switching selector, such as an ovonic threshold switch. The threshold switching selector switches to a conducting state when a voltage above a threshold voltage is applied. When powered down for extended periods, the threshold voltage can drift upward. If the drift is excessive, this can make the memory cell difficult to access and can disturb stored data values when accessed. Techniques are presented to determine whether excessive voltage threshold drift may have occurred, including a read based test and a time based test. Techniques are also presented for initializing a cross-point array, for both first fire and cold start, by using voltage levels shifted from half-select voltage levels used in a standard memory access.

First fire and cold start in memories with threshold switching selectors

In a memory array with a cross-point structure, at each cross-point junction a programmable resistive memory element, such as an MRAM memory cell, is connected in series with a threshold switching selector, such as an ovonic threshold switch. The threshold switching selector switches to a conducting state when a voltage above a threshold voltage is applied. When powered down for extended periods, the threshold voltage can drift upward. If the drift is excessive, this can make the memory cell difficult to access and can disturb stored data values when accessed. Techniques are presented to determine whether excessive voltage threshold drift may have occurred, including a read based test and a time based test.

Power off recovery in cross-point memory with threshold switching selectors

Technology for limiting a voltage difference between two selected conductive lines in a cross-point array when using a forced current approach is disclosed. In one aspect, the selected word line voltage is clamped to a voltage limit while driving an access current through a region of the selected word line and through a region of the selected bit line. The access current flows through the memory cell to allow a sufficient voltage to successfully read or write the memory cell, while not placing undue stress on the memory cell. In some aspects, the maximum voltage that is permitted on the selected word line depends on the location of the selected memory cell in the cross-point memory array. This allows memory cells for which there is a larger IR drop to receive an adequate voltage, while not over-stressing memory cells for which there is a smaller IR drop.

Forced current access with voltage clamping in cross-point array

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San Jose, CA, United States of America

Michael Grobis