Kla Tencor Corporation

Kla Corporation

Michael Cook

Kenong Wu

Hong Chen

Bjorn Brauer

Eugene Shifrin

Xiaochun Li

James A Smith

Nurmohammed Patwary

Ramon Ynzunza

Pavan Kumar

Wei Si

Qing Luo

Leon Yu

Neil Troy

Systems and methods for detecting defects on a reticle are provided. One system includes computer subsystem(s) configured for performing at least one repeater defect detection step in front-end processing during an inspection process performed on a wafer having features printed in a lithography process using a reticle. The at least one repeater defect detection step performed in the front-end processing includes identifying any defects detected at corresponding locations in two or more test images by double detection and any defects detected by stacked defect detection as first repeater defect candidates. One or more additional repeater defect detections may be performed on the first repeater defect candidates to generate final repeater defect candidates and identify defects on the reticle from the final repeater defect candidates.

Print check repeater defect detection

A method may include, but is not limited to, receiving a plurality of reference images of a wafer. The method may include, but is not limited to, receiving the plurality of test images of the wafer. The method may include, but is not limited to, aligning the plurality of reference images and the plurality of test images via a coarse alignment process. The method may include, but is not limited to, aligning the plurality of reference images and the plurality of test images via a fine alignment process after alignment via the coarse alignment process. The fine alignment process may include measuring individual offsets and correcting individual offset data between at least one of the plurality of reference images and the plurality of test images.

System and method for aligning semiconductor device reference images and test images

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Windsor, United Kingdom

Michael Cook