Semiconductor Technologies & Instruments Pte. Ltd.

Michael C Zemek

Rajiv Roy

Weerakiat Wahawisan

Charles K Harris

Troy D Moore

Michael D Glucksman

James E Loveless

Paul Harris Hasten

Dennis M Botkin

Joseph Antao

An inspection system determines if leads of a semiconductor device are in proper positions. Images from at least two sides of the semiconductor device are captured along with calibration marks formed in the side of a track upon which the semiconductor device is mounted. All leads and calibration marks are captured in a single video image, the images from one side of the semiconductor device being off set from the image from the other side.

High speed lead inspection system

A computer vision apparatus and methods for automatically inspecting 2-dimensional (2D) and 3-dimensional (3D) criteria of objects using a single camera and laser sources. A camera views the object under inspection which is illuminated by a first source of light to highlight the region of interest. This provides image data for 2d analysis by a computer coupled to the system. Subsequently, multiple laser sources mounted on a positioner provide the illumination for collecting images for 3 dimensional analysis. A computer with a monitor is connected to the camera to perform the inspection and analysis and for operator supervision of the system. Specific implementations provided refer to embodiments for inspecting packaged semiconductor devices such as Ball-Grid Arrays (BGAs) packages and Quad Flat Packages (QFPs) packages for package mark inspection, package defect inspection, and solder ball or lead defects. Further, the apparatus and methods of the invention can be applied to the inspection of chip sized packages and to Flip-Chip Bump, and I.C. Die inspection. The system can also be used to inspect bond wire Wire Loop Height and to perform automated Quality Inspection for critical assembly of disk-drives, CD-Roms, keyboards, other assemblies in the computer industry and in other industries.

Method and apparatus for inspecting a workpiece

A lead conditioning system (10) conditions leads (74) of electronic component package (30) and includes a rotary table (16) for holding electronic component package (30) and making accessible the leads (74). A conditioning tool (20) includes conditioner arm (34) and conditioner blade (70) that selectively contacts a predetermined number of the leads (74). A manipulator (22) moves conditioning tool (20) to positions that contact a predetermined number of leads (74) to condition leads (74). A control system (24) controls the operation of manipulator (22).

Programmable lead conditioner

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Rowlett, TX, United States of America

Michael C Zemek