Intel Corporation

Other

Melissa K Shell

Robert L Bristol

Manish Chandhok

Kramadhati V Ravi

Bryan J Rice

John P Barnak

Ming Fang

Richard S Yoshimoto

Passivation coatings and gettering agents may be used in an Extreme Ultraviolet (EUV) source which uses tin (Sn) vapor as a plasma 'fuel' to prevent contamination and corresponding loss of reflectivity due to tin contamination. The passivation coating may be a material to which tin does not adhere, and may be placed on reflective surfaces in the source chamber. The gettering agent may be a material that reacts strongly with tin, and may be placed outside of the collector mirrors and/or on non-reflective surfaces. A passivation coating may also be provided on the insulator between the anode and cathode of the source electrodes to prevent shorting due to tin coating the insulator surface.

Technique to prevent tin contamination of mirrors and electrodes in an EUV lithography system

Erosion-resistive coatings are provided on critical plasma-facing surfaces of an electrical gas plasma head for an EUV source. The erosion-resistive coatings comprise diamond and diamond-like materials deposited onto the critical plasma-facing surfaces. A pure diamond coating is deposited onto the plasma exposed insulator surfaces using, for example, a chemical vapor deposition processes. The diamond coating is made conductive by selective doping with p-type material, such as, but not limited to, boron and graphite.

Protective coatings for radiation source components

An insulator may be operable to electrically insulate a cathode from an anode in an extreme ultraviolet (EUV) source of an EUV lithography tool. The insulator may be made of an aluminosilicate or a SiN/SiC material. The extreme ultraviolet source may be operable to produce a plasma which emits extreme ultraviolet radiation.

Electrode insulator materials for use in extreme ultraviolet electric discharge sources

A method for removing deposits from a probing feature of a probe card. The method includes the step of exposing the probing feature of a probe card to a composition that chemically reacts with the deposits on the probing feature to remove the deposits from the probing feature while not substantially effecting the material comprising the probing feature.

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Sunnyvale, CA, United States of America

Melissa K Shell