Merck Patent Gmbh

Az Electronic Materials USA Corp.

Az Electronic Materials (luxembourg) S.a.r.l.

Clariant Finance (bvi) Limited

Medhat A Toukhy

Weihong Liu

Ralph R Dammel

Hengpeng Wu

Ping-Hung Lu

Chunwei Chen

PingHung Lu

SookMee Lai

Mark O Neisser

Joseph E Oberlander

Shuji Sue Ding-Lee

Raj Sakamuri

Jian Yin

Takanori Kudo

Salem K Mullen

Margareta Paunescu

Tomohide Katayama

Aritaka Hishida

Hung-Yang Chen

Yoshiharu Sakurai

SangChul Kim

Anupama Mukherjee

Yu Sui

Wen-Bing Kang

Stephen Meyer

Pinghung Lu

Sookmee Lai

Sangchul Kim

The present invention relates to resist compositions comprising a polymer component, a photoacid generator component (PAG), a photoactive diazonaphthoquinone component (PAC), a base component, a solvent component, and optionally, a heterocyclic thiol component. The polymer component is a Novolak derivative, comprising Novolak repeat units with free phenolic hydroxy moieties, and Novolak repeat units comprising phenolic hydroxy moieties protected with an acid cleavable acetal moiety. The acetal moiety is elected from a mono functional alkyl acetal moiety protecting a repeat unit comprising a Novolak phenolic hydroxy moiety, an acetal, comprising a moiety functionalized with a PAC moiety, protecting a repeat unit comprising a Novolak phenolic hydroxy moiety; a di-functional acetal comprising moiety, linking and protecting two repeat units comprising Novolak phenolic hydroxy moieties, forming a linking point in said polymer component between two different polymer chains in said polymer component, and a mixture of any of these three types of acid cleavable acetal moieties. The PAC component is selected from said acetal, comprising a moiety functionalized with a PAC moiety, protecting a repeat unit comprising a Novolak phenolic hydroxy moiety, a free PAC component, and a mixture of these two types of PAC components. The present invention also relates to the methods of using the present compositions in either in thick or thin film photoresist device manufacturing methodologies.

Novolak/DNQ based, chemically amplified photoresist

A negative-acting, photoresist composition, imageable by 365 nm radiation that is developable in aqueous base. Apart from solvent, this composition comprises: a) an aqueous base soluble phenolic film-forming polymeric binder resin having ring bonded hydroxyl groups; b) a photoacid generator c) a crosslinking agent which comprises an etherified melamine; d) a dye as described herein; e) a quencher system consisting essentially of an amine quencher, or a mixture of such amine quenchers, as described. This invention also pertains to processes of using this composition as a photoresist.

Negative resist formulation for producing undercut pattern profiles

Describe herein is a composition comprising: an acrylic polymer comprising repeat units selected from ones having structure (1), (2), (3), (4), (5), (6), and (7) wherein these repeat units are present in said acrylic polymer in the mole % ranges as described herein; a Novolak resin having a dissolution rate in 0.26 N aqueous TMAH of at least 50 &#x212b;/sec; a diazonaphthoquinone (DNQ) photoactive compound (PAC); and an organic spin casting solvent, and a process of using said composition as a positive photoresist developable in aqueous base.

DNQ-type photoresist composition including alkali-soluble acrylic resins

Environmentally stable, chemically amplified (CA) positive resist compositions are described. These resist compositions are based on a blend of at least two types of polymer platforms. The first platform is a low activation energy, acetal blocked polyhydroxystyrene (PHS) based resin; the second platform is an acrylate based resin containing a high activation energy acid labile group [such as tertiary-butyl acrylate(t-BA)]. The resist composition also contains a photo-acid generator (PAG), a base quencher, a surfactant dissolved in a suitable solvent. Also described, is the use of these resist composition in a method for forming a photoresist relief image on a substrate.

Enviromentally stable, thick film, chemically amplified resist

The invention relates to a novel positive working photosensitive composition having: at least one photoacid generator; at least one novolak polymer; at least one polymer, having a polymer backbone, said polymer comprising a structure of the following formula: wherein R-Rare, independently, &#x2014;H or &#x2014;CH, A is a linear or branched C-Calkylene group, B is a C-Calkyl or alicyclic group, D is a linking group that may be a chemical bond, a carboxylate group, wherein the carbonyl carbon is bonded to the polymer backbone, or a &#x2014;COOCH&#x2014; group, wherein the carbonyl carbon is bonded to the polymer backbone, Ar is a substituted or unsubstituted aromatic group or heteroaromatic group, E is a linear or branched C-Calkylene group, G is an acid cleavable group. The invention further relates to a process for using the novel composition for forming an image.

Positive photosensitive material

Disclosed are compositions for negative-working thick film photophotoresists based on acrylic co-polymers. Also included are methods of using the compositions.

Negative-working thick film photoresist

Disclosed herein is a photosensitive composition comprising a heterocyclic thiol compound or tautomeric form thereof and its method of use on a substrate, which may include a chalcophile substrate.

Positive working photosensitive material

Thick film photoresist compositions are disclosed.

Thick film resists

The present invention provides for a light-sensitive photoresist composition useful for imaging thick films, comprising a polymer which is insoluble in an aqueous alkali developer but becomes soluble prior to development, a photoacid generator which produces a strong acid upon irradiation and a photobleachable dye. The invention further provides for a process for imaging the photoresist of the present invention, especially where the thickness of the photoresist is up to 200 microns and where the process comprises a single exposure step.

Photoresist composition for imaging thick films

Disclosed is a process for forming an image on a substrate, comprising the steps of: (a) coating on the substrate a first layer of a radiation sensitive, antireflective composition; (b) coating a second layer of a photoresist composition onto the first layer of the antireflective composition; (c) selectively exposing the coated substrate from step (b) to actinic radiation; and (d) developing the exposed coated substrate from step (c) to form an image; wherein both the photoresist composition and the antireflective composition are exposed in step (c); both are developed in step (d) using a single developer; wherein the antireflective composition of step (a) is a first minimum bottom antireflective coating (B.A.R.C.) composition, having a solids content of up to about 8% solids, and a maximum coating thickness of the coated substrate of wherein &#x3bb; is the wavelength of the actinic radiation of step (c) and n is the refractive index of the B.A.R.C. composition.

Process for producing an image using a first minimum bottom antireflective coating composition

The present invention relates to a novel absorbing, photoimageable and aqueous developable positive-working antireflective coating composition comprising a photoacid generator and a polymer comprising at least one unit with an acid labile group and at least one unit with an absorbing chromophore. The invention further relates to a process for using such a composition. The present invention also relates to a novel absorbing, photoimageable and aqueous alkali developable positive-working antireflective coating composition comprising a polymer comprising at least one unit with an acid labile group, a dye and a photoacid generator. The invention further relates to a process for using such a composition. The invention also relates to a novel process for forming a positive image with a positive photoresist and a novel photoimageable and aqueous developable positive-working antireflective coating composition, where the antireflective coating comprises a polymer comprising an acid labile group. The invention further relates to such a composition. The invention also relates to a process for imaging a photoimageable antireflective coating composition.

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Flemington, NJ, United States of America

Medhat A Toukhy