Wacker-chemitronic Gesellschaft Fur Elektronik-grundstoffe Mbh

Max Stadler

Gerhard Brehm

Peter Romeder

Rudolf Mayrhuber

Gunter Schwab

Manuela Knipf

Jurgen Schuhmacher

A process for the wet-chemical treatment of workpieces, especially of semiconductor wafers, includes exposing the workpieces to a flow of a gassified treatment medium generated by homogeneously dispersing gas bubbles in a liquid.

Process for the wet-chemical treatment of disk-shaped workpieces

A process and liquid preparation is disclosed for removing residues from ers sawn from crystalline rods. In sawing rod-shaped workpieces such as semiconductor rods, for example, into wafers, by means of an internal-hole saw, auxiliary sawing materials such as for example cutting strips are often attached to the rods. According to the present invention, the residues of such auxiliary sawing materials remaining on the wafers obtained after the sawing operation can be removed particularly easily by means of immersion in baths of aqueous carboxylic solutions and, in particular, aqueous formic acid.

Method and liquid preparation for removing residues of auxiliary sawing

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Haiming, Germany

Max Stadler