Hitachi Global Storage Technologies Netherlands B.v.

Matthew W Last

Edward Hin Pong Lee

Ian Robson McFadyen

Christian Rene Bonhote

John W Lam

Heather K DeSimone

An electroplated film is deposited over a substrate with a plating frame pattern that includes a plating field defined by a plurality of individual features. By dividing the plating field into a plurality of individual features, the delamination force at any location on the plating field is greatly reduced. Thus, a film with a large stress, such as a high moment film, may be plated to a greater thickness than is possible with conventionally plated films.

Growing community of inventors

San Jose, CA, United States of America

Matthew W Last