Lsi Logic Corporation

Matthew Preston

Sutee Vongfuangfoo

Damage to the package body and external leads of a leaded semiconductor device assembly is prevented by a carrier assembly. The carrier assembly includes a rigid bottom (lower) plate positively supporting the package body and providing a bottom cover for the external leads. A semi-rigid top (upper) plate positively holds the package body against the bottom plate, prevents movement of the package body with respect to the carrier assembly, and covers the external leads. Fasteners are provided for securing the upper plate to the lower plate, preferably at the four corners of the plates. In this manner, a durable 'sandwich' structure is created, with the package disposed between the lower and upper plates and the body and leads well protected against damage.

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San Jose, CA, United States of America

Matthew Preston