Kla Tencor Corporation

Kla-Tencor Technologies Corporation

Matthew Marcus

David Lewis Adler

Lee H Veneklasen

A method of inspecting and imaging substrates with an electron beam. The method can include a illuminating the substrate with a photon beam to cause photoemission of electrons. A low energy electron beam can be used to prevent or reduce positive charging of the substrate. Reflected electrons and/or emitted photoelectrons can be imaged to review or inspect the substrate.

Photoelectron emission microscope for wafer and reticle inspection

A novel dual beam low energy electron microscope (LEEM) apparatus for inspecting semiconductor circuits or masks. Direct imaging records many pixels in parallel, offering higher inspection rates than prior art scanning methods. A low energy flood beam is superimposed with a second, higher energy flood beam. The use of two beams avoids charging effects upon insulating or partially insulating substrates. Under appropriate conditions, the net charging flux to each image element can be balanced on a pixel by pixel, as well as global basis. Either the low energy or the higher energy beam may be used to form an image of the surface. An electron optical apparatus and configuration for this dual beam LEEM is described.

Growing community of inventors

Berkeley, CA, United States of America

Matthew Marcus