Konica Minolta, Inc.

Masayoshi Yamauchi

Hidenobu Ohya

Naoto Niizuma

Takenori Omata

Hideki Hoshino

Masayuki Ushiku

Ryo Aoyama

Kazuho Urayama

A pattern forming method capable of easily removing a discontinuous portion in a pattern while keeping resistance of the pattern low. A pattern forming method including at least a printing step of printing a pattern intermediate containing a conductive material on a base material, and a plating step of subjecting the pattern intermediate to an electroplating treatment, in which the pattern intermediate printed in the printing step has a plating target portion that is energized in the plating step and a discontinuous portion that is discontinuously formed from the plating target portion and is not energized in the plating step, and in the plating step, by performing an electric field plating treatment using a plating solution containing at least two or more types of metal salts containing different types of metals and a complexing agent, the discontinuous portion of the pattern intermediate is removed to form a pattern constituted by the plating target portion covered with a plating film.

Pattern forming method

Provided are a substrate with a functional fine line having excellent optical properties and excellent adhesion of the functional fine line, and a method for forming the functional fine line. The substrate with a functional fine line according to the present invention has an undercoat layer including a hydrophobically modified polyester resin on the substrate, and has a functional fine line including a deposit of functional microparticles and having a line width of 1 &#x3bc;m or more and 10 &#x3bc;m or less on the undercoat layer. The method for forming a functional fine line according to the present invention includes forming an undercoat layer including a hydrophobically modified polyester resin on a substrate, and then forming a functional fine line including a deposit of functional microparticles and having a line width of 1 &#x3bc;m or more and 10 &#x3bc;m or less on the undercoat layer.

Substrate with functional fine line and method for forming functional fine line

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Chofu, Japan

Masayoshi Yamauchi