Tokyo Electron Limited

Masaru Isago

Hiroshi Tsujimoto

Keigo Toyoda

Hiraku Murakami

A plasma processing apparatus capable of achieving a uniform plasma space therein is provided. The plasma processing apparatus includes a processing vessel, a mounting table, a shield member, a shutter for an opening configured to be moved up and down, a first driving unit and a second driving unit. The processing vessel has a sidewall, and the sidewall is provided with a transfer path through which a processing target object is carried-in/carried-out. The mounting table is provided within the processing vessel. The shield member is provided along an inner surface of the sidewall to surround the mounting table and provided with an opening facing the transfer path. The first driving unit is configured to move the shutter up and down. The second driving unit is configured to move the shutter in a forward-backward direction with respect to the shield member.

Plasma processing apparatus

There is provision of a cleaning method of a plasma processing apparatus including a plasma treatment chamber for applying plasma treatment to a substrate. The method includes: insulating a part of the plasma treatment chamber, generating plasma of fluorocarbon gas in the plasma treatment chamber, and removing deposits on a non-plasma surface of a space outside of the plasma treatment chamber, by the plasma of the fluorocarbon gas introduced from the plasma treatment chamber to the outside space.

Method of cleaning plasma processing apparatus

An etching method for performing a plasma etching on an object to be processed by using a supplied gas is provided. In the etching method, a temperature of a focus ring is adjusted by using a first temperature adjustment mechanism controllable independently of a temperature control of the object to be processed while measuring a time variation until the temperature of the focus ring reaches a target value. A degree of consumption of the focus ring is estimated from the measured time variation based on a preliminarily set correlation between the time variation and the degree of consumption of the focus ring. The target value of the temperature of the focus ring is corrected based on the estimated degree of consumption of the focus ring.

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Miyagi, Japan

Masaru Isago