Fujitsu Corporation

Kyushu Fujitsu Electronics Limited

Masanori Yoshimoto

Michio Sono

Junichi Kasai

Kazuto Tsuji

Kouji Saito

Mitsutaka Sato

Masashi Takenaka

Kouichi Takeshita

Norio Taniguchi

Tsuyoshi Aoki

Tetsuya Fujisawa

Masao Sakuma

Hiroshi Yoshimura

Ichiro Yamaguchi

Koki Otake

Tadashi Uno

Kazuhiko Mitobe

Katsuhiro Hayashida

Akihiro Kubota

Kosuke Otokita

Keiichi Masaki

A semiconductor device includes a board having a lower surface, a container part created in the board, external-connection nodes provided on the lower surface of the board, a supporting member provided inside the container part and secured by the board, a semiconductor chip secured on the supporting member and electrically connected with the external-connection nodes, and a sealing resin fully filling the container part so as to completely cover the semiconductor chip.

Semiconductor device and method of forming the device

A semiconductor device having a package of a single in-line type includes a semiconductor chip, a package body that accommodates the semiconductor chip therein and defined by a pair of opposing major surfaces and a plurality of interconnection leads held by the package body to extend substantially perpendicularly to a bottom surface. Each of the interconnection leads consists of an inner lead part located inside the package body and an outer lead part located outside the package body, the outer lead part being bent laterally at a boundary between the inner part and the outer part, in one of first and second directions that are opposite from each other and substantially perpendicular to the opposing major surfaces of the package body. A plurality of support legs extend laterally at the bottom surface of the package body for supporting the package body upright when the semiconductor device is placed on a substrate.

Semiconductor package for surface mounting

A semiconductor device is adapted to be mounted on a circuit substrate in an approximate vertical position. The semiconductor device includes a semiconductor chip, a stage having a first surface and a second surface opposite to the first surface, where the semiconductor chip is mounted on the first surface, a resin package encapsulating the semiconductor chip, where the resin package has upper and lower surfaces and side surfaces, a plurality of leads respectively having one end electrically connected to the semiconductor chip and another end extending downwardly from the lower surface of the resin package, and an upper extension, provided on the stage, extending upwardly from the upper surface of the resin package.

Semiconductor device and semiconductor device unit

A process for manufacturing semiconductor package of a single in-line type including a semiconductor chip, a package body for accommodating the semiconductor chip and a plurality of leads held by the package body to extend substantially perpendicularly to a bottom edge surface of the package body. The package body carries a cutout part at a predetermined position of a side edge that surrounds the package body such that the cutout part is adapted for engagement with a support leg for supporting the package body substantially upright on a substrate.

Process for manufacturing a single in-line package for surface mounting

A semiconductor device unit includes a holder having a plurality of holding parts, and a plurality of semiconductor devices held by the holding parts of the holder. Each of the semiconductor devices has a generally parallelepiped shape with top and bottom surfaces and at least one side surface provided with leads which are exposed whereby the semiconductor device unit stands by itself on the leads.

Semiconductor device unit having holder

A method of producing a semiconductor device includes the steps of fitting a bottom part of a radiator block within a tapered hole which is provided at a bottom of a recess of a jig and positioning on the jig a lead frame having inner and outer leads and wherein the lead frame has an opening at a central part thereof, the opening being located above a top surface of the radiator block. The semiconductor chip is then mounted on the top surface part of the radiator block and bonded to the lead frame by plurality of wires. The radiator block is then positioned on a lower die and an upper die is positioned on top of the lower die and a resin is injected into a cavity formed by the two dies so as to mold the resin and form a package which encapsulates at least a part of the radiator block, the semiconductor chip, the wires and inner leads of the lead frame so that the outer leads of the lead frame extend outwardly of the package and the bottom part of the radiator block projects from the package by a predetermined length to conduct heat generated from the semiconductor chip outside the package. The jig then is removed from the package.

Semiconductor device having radiator structure

A semiconductor device includes a semiconductor chip having top and bottom surfaces, upper leads electrically coupled to the semiconductor chip, where a first gap is formed between the upper leads and the top surface of the semiconductor chip, lower leads electrically coupled to the semiconductor chip, where a second gap is formed between the lower leads and the bottom surface of the semiconductor chip, and an encapsulating resin which encapsulates the semiconductor chip so as to maintain the first and second gaps.

Semiconductor device affixed to an upper and a lower leadframe

Semiconductor package for surface mounting with reinforcing members on

A semiconductor package of a single in-line type including a semiconductor chip, a package body for accommodating the semiconductor chip and a plurality of leads held by the package body to extend substantially perpendicularly to a bottom edge surface of the package body. The package body carries a cutout part at a predetermined position of a side edge that surrounds the package body such that the cutout part is adapted for engagement with a support leg for supporting the package body substantially upright on a substrate.

Single in-line package for surface mounting

Process for encapsulating a semiconductor package having a heat sink

A process for manufacturing semiconductor device including a semiconductor chip having top and bottom surfaces, upper leads electrically coupled to the semiconductor chip, where a first gap is formed between the upper leads and the top surface of the semiconductor chip, lower leads electrically coupled to the semiconductor chip, where a second gap is formed between the lower leads and the bottom surface of the semiconductor chip, and an encapsulating resin which encapsulates the semiconductor chip so as to maintain the first and second gaps.

Process for manufacturing a semiconductor device affixed to an upper and

A process for producing a semiconductor device having a package with a semiconductor element molded therein, and a plurality of leads, each constituted by an inner lead located inside the package and an outer lead located outside the package, the leads being arranged in a line at a predetermined pitch, and the semiconductor element being electrically connected to the inner lead of each of the leads, wherein each side edge of each of the outer leads is flat.

Semiconductor device and a process for making same having improved leads

A semiconductor device includes a semiconductor chip mounted in a resin package body. A plurality of interconnection leads are provided on the resin package body along a lower edge thereof and project outwardly from the lower edge. A heat dissipation lead is connected to the resin package body for dissipating heat generated by the semiconductor chip. The heat dissipation lead includes a plate of a heat conducting material having a stage part and a heat sink part, wherein the stage part is held inside the resin package body and supports the semiconductor chip thereon. The heat sink part projects outwardly from the resin package body and includes a part that extends in a downward direction. The heat sink part has a lower edge that is formed at a level substantially flush with the outer lead part of the interconnection leads such that the semiconductor device is held upright, when placed on a substrate, by the outer lead part of the interconnection leads and by the lower edge of the heat sink part of the heat dissipation lead.

Surface-mounting type semiconductor package having an improved

A lead frame for manufacturing a semiconductor device has at least one set of substantially parallel leads having inner ends for connection to a semiconductor chip, outer ends for external connection and central portions therebetween and an outer tiebar interconnecting the outer ends and having an elongated guide hole therein, the longer dimension of the guide hole being parallel to the leads. A lead bending die has a locating pin respectively corresponding to and received in sliding engagement in each guide hole. The die maintains a center portion of them lead frame in a first plane and, with each locating pin remaining in sliding engagement within the respective, elongated guide hole, bends the central portions of the leads thereby to dispose the respective outer ends of the leads in a second plane, displaced from the first plane. The outer tiebar and the sliding engagement of the locating pin in the guide hole serve to prevent undesirable deformation of the leads as a result of the bending operation. The central surface portion of the die further includes a recess for receiving at least a part of a package which seals a semiconductor chip therewithin. The lead frame may include plural sets of substantially parallel leads with corresponding outer tiebars and associated guide holes extending from respective, plural edges of the package.

Growing community of inventors

Kawasaki, Japan

Masanori Yoshimoto