Canon Kabushiki Kaisha

Masami Yonekawa

Hisanobu Azuma

Shinichi Hara

Yasuyuki Unno

Ryo Edo

Yoichi Matsuoka

Seiji Orii

Yozo Fukagawa

Akira Miyake

Toshihiro Ifuku

Keiji Emoto

Shigeru Terashima

Mitsuru Inoue

Tomohiro Saito

Kazuki Nakagawa

Kiyohito Yamamoto

Toshihiro Maeda

The present invention provides an evaluation method for evaluating a state in an apparatus concerning particles existing inside a substrate processing apparatus for processing a substrate, including arranging a plate in a charged state inside the apparatus and obtaining the number of particles adhered to the plate by performing a dummy operation different from an operation of processing the substrate, and evaluating the state in the apparatus based on a coefficient representing a ratio of the number of particles adhered to the plate by performing the dummy operation for the plate in an uncharged state to the number of particles adhered to the plate in the charged state, and the number of particles obtained in the arranging the plate.

Evaluation method, substrate processing apparatus, manufacturing method of substrate processing apparatus and article manufacturing method

A curable composition on a substrate is cured in a state where a member is in contact with the curable composition. Thereafter, the member having adhered to the curable composition is separated from the substrate, whereby the curable composition and a particle are removed from the substrate.

Particle removal method, particle removal apparatus, and method for manufacturing article

The present invention provides a container for containing a plate to be used to remove particles in a processing apparatus for processing a substrate, comprising: a charging unit configured to charge the stored plate, wherein the charging unit includes a contactor configured to be in contact with the plate, and is configured to charge the plate by supplying electric charges to the plate via the contactor and then separating the contactor from the plate.

Container, processing apparatus, particle removing method, and method of manufacturing article

An imprint apparatus forms a pattern on a substrate by curing an imprint material on the substrate while the imprint material is in contact with a mold. The imprint apparatus includes a substrate chuck having a substrate holding region for holding the substrate, a peripheral member arranged to surround the side surface of the substrate held by the substrate chuck, and a control unit configured to control a cleaning process for cleaning at least a partial region of the peripheral member by using a cleaning member including a charging unit. The cleaning process includes an operation for attracting a particle in the partial region to the charging unit by moving the cleaning member relative to the peripheral member while the charging unit faces at least the partial region of the peripheral member.

Imprint apparatus, method of operating the same, and method of manufacturing article

There is provided an imprint apparatus for forming a pattern of an imprint material on a substrate by using a mold, the imprint apparatus including a mold holding unit configured to hold the mold, and a substrate holding unit configured to hold the substrate, in which a particle is captured by generating a first region and a second region charged to different polarities in at least either one of a peripheral region of a region covered by the mold of the mold holding unit and a peripheral region of a region covered by the substrate of the substrate holding unit.

Imprint apparatus, method for manufacturing article, and exposure apparatus

A lithography apparatus that forms a pattern on a substrate, and the lithography apparatus includes: a holding unit that holds the substrate; and a cleaning member that brings a polishing unit into contact with the holding unit to clean the holding unit, in which the cleaning member includes a supply port which is arranged in the polishing unit and through which gas is supplied, and a suction port which is arranged in a periphery of the polishing unit and through which gas is sucked.

Lithography apparatus and method of manufacturing article

A lithography apparatus transfers a pattern of an original to a substrate. The apparatus includes an electrode structure arranged so as to surround a side surface of one of the substrate and the original, and a power supply configured to supply an alternating voltage to the electrode structure. The electrode structure includes a plurality of electrode groups electrically insulated from each other, each electrode group including a plurality of electrodes electrically connected to each other, and the power supply supplies alternating voltages having different phases to the plurality of electrode groups.

Lithography apparatus and article manufacturing method

A reflective original includes: a reflection layer which has a multilayer film configured to reflect extreme ultraviolet light; a base material configured to support the reflection layer; and a thermal diffusion layer interposed between the reflection layer and the base material, and configured to diffuse heat of the reflection layer. A heat capacity, per unit area, of a structure constituted by both the reflection layer and the thermal diffusion layer is not lower than 1.1 (J/(K&#xb7;m)).

Reflective original, exposure method, and device manufacturing method

A trapping device that traps a particle in a vacuum atmosphere includes a plurality of grooves arrayed on a surface of the trapping device. Each of the plurality of grooves has a shape that is obtained by replacing a bottom part of a U-groove is replaced with a V-groove.

Trapping device that traps particles in vacuum atmosphere

An exposure apparatus configured to expose a pattern of an original onto a substrate includes a wire electrode row that includes plural parallel wire electrodes, and that is opposed to the original, and a power source that applies an AC voltage to the plural wire electrodes, wherein the wire electrode row includes a first electrode group, and a second wire electrode group to which an AC voltage having a phase different from that of an AC voltage applied to the first electrode group is applied.

Exposure apparatus and original

An exposure apparatus for executing an exposure of a substrate to light via a mask. The apparatus includes a booth which stores the mask in an atmospheric pressure, a processing chamber in which the exposure is executed in a first vacuum pressure, a vacuum chamber, arranged between the booth and the processing chamber, stores the mask at a second vacuum pressure that is higher than the first vacuum pressure and is between 0.1 Pa and 100 Pa, a first load lock chamber, arranged between the booth and the vacuum chamber, through which the mask is transferred, in which the atmospheric pressure and the second vacuum pressure are replaceable, and a second load lock chamber arranged between the vacuum chamber and the processing chamber, through which the mask is transferred, in which the second vacuum pressure and the first vacuum pressure are replaceable.

Exposure apparatus having a processing chamber, a vacuum chamber and first and second load lock chambers

At least one exemplary embodiment is directed to an apparatus which includes an original stage, to hold an original, which moves in a scan direction, an illumination optical system configured to illuminate the original held by the original stage with exposure light, a substrate stage configured to hold a substrate and to move in a scan direction, a projection optical system configured to project a pattern of the original onto the substrate with the exposure light, and an irradiation unit configured to irradiate the original held by the original stage. Irradiation by the irradiation unit and movement of the original stage in the scan direction are carried out substantially in parallel with each other so as to remove a contaminant on the original.

Apparatus and method for removing contaminant on original, method of manufacturing device, and original

An exposure apparatus for exposing a substrate. The apparatus includes an optical system being set at a reference temperature, for directing light to the substrate, an exposure chamber for storing the optical system in a vacuum ambience, and a load-lock chamber, disposed adjacent to the exposure chamber, for converting an ambience of a space surrounding the substrate into a vacuum ambience. When the load-lock chamber converts the ambience of the space surrounding the substrate into a vacuum ambience, the temperature of the load-lock chamber is made higher than the reference temperature.

Exposure apparatus and device manufacturing method

Accurate alignment can be attained irrespective of strains of the main body structure. An exposure apparatus, which has a substrate stage ( ) which holds and moves a substrate ( ), a position measurement unit ( ) for measuring the position of the substrate stage, and a control unit ( ) for performing drive control of the substrate stage to align the substrate on the basis of the measured position, and which aligns the substrate and a master plate ( ), and forms a pattern on the master plate on the substrate by exposure, has a strain measurement unit ( ) for measuring strain of a structure ( ) to which the position measurement unit is fixed, and the control unit aligns the substrate by the drive control of the stage in consideration of the measured strain.

Growing community of inventors

Utsunomiya, Japan

Masami Yonekawa