Tokyo Ohka Kogyo Co., Ltd.

Nissan Motor Company Limited

Ngk Insulators, Inc.

Other

Fujitsu Corporation

Kabushiki Kaisha Toshiba

Komatsu Electronic Metals Co., Ltd.

Kanto Seiki Co., Ltd.

Rohm Co., Ltd.

Toshiba Electronic Devices & Storage Corporation

Nippon Columbia Co., Ltd.

Nippon Shokenbai Co., Ltd.

Masakazu Kobayashi

Toshimasa Nakayama

Kazumasa Wakiya

Masahito Tanabe

Kazuhiko Shinohara

Makoto Miyoshi

Keiko Kushibiki

Yuichiro Imanishi

Kenji Furuya

Tetsuo Watanabe

Etsuko Iguchi

Yuki Nakajima

Hiroshi Komano

Hatsuyuki Tanaka

Takako Hirosaki

Mitsuru Sato

Yoshio Shimoida

Yoichiro Tanaka

Yasuhiko Kitajima

Yutaro Kaneko

Masahiro Tsukamoto

Junsuke Tomioka

Tadayuki Hatsuda

Shingo Asaumi

Toshiro Shinohara

Shoei Kurosaka

Hiroyuki Kaneko

Shozo Suzuki

Makoto Iwashima

Kouichirou Yonekura

Akihiro Hanamura

Hideaki Horie

Takanori Saito

Osamu Shimamura

Ken Nakao

Takaaki Abe

Hisashi Nakane

Fumitake Kaneko

Kyoichi Watanabe

Norio Fujiki

Noboru Hattori

Kenji Okamura

Toshikazu Tachikawa

Naotaka Kubota

Fumio Munakata

Kazuhiro Mimura

Miwa Miyairi

Hiroshi Monden

Yoichi Hori

Shigeru Yokoi

Kazuki Miyatake

Hiroshi Yoshinada

Akira Yokota

Naritoshi Ohtsukasa

Mitsuo Takeda

Norihiko Saito

Tomio Konn

Tomohiro Nagata

Hidetoshi Nakanishi

Satomi Furukawa

Hiroshi Murase

Hideaki Terauchi

Yoshikazu Kato

Sunao Seko

Tetsuji Ishikawa

Toshikatsu Hino

Hideyuki Yokoyama

Yasumitsu Taira

Takatoshi Hayashi

Tomiyuki Segawa

Shuji Onoue

Yoshihito Nakamura

Akihiro Enomoto

Tsuyoshi Sadamatsu

Keizi Ishizuka

Masanori Narita

Keiko Ikoma

Yoshikuni Kurita

Takashi Nishimoto

Osamu Saitou

Toshio Chaki

Hideaki Hori

A semiconductor device according to an embodiment includes first and second electrode, and semiconductor layer between the first and the second electrode. The semiconductor layer has first and second plane. The semiconductor layer includes first region of first conductivity type, second region of second conductivity type between the first plane and the first region, third region of second conductivity type between the first plane and the first region and, fourth region of second conductivity type between the second and the third region, and fifth region of first conductivity type having first portion provided between the first and the fourth region. Width of the fourth region is larger than that of the second region. Distance between the second region and the first portion is smaller than distance between the second and the fourth region. And width of the first portion is smaller than that of the fourth region.

Semiconductor device having Schottky barrier diode

Disclosed is a cell with a power-generating element and an outer package. The power-generating element includes a unit cell layer including a first electrode, a second electrode and an electrolyte layer disposed between the first and second electrodes. In the first electrode, a first collector is provided with one of a positive electrode active material layer and a negative electrode active material layer. In the second electrode, a second collector is provided with the other one of the positive and negative electrode active material layers. The first and second collectors have thicknesses such that when a conductor from outside penetrates at least two cells and a short circuit is formed between two cells via the conductor, shorted portions of the first and second collectors are fused by the heat generated by the current before the temperature of the cells reaches a predetermined value so that the short circuit is blocked.

Cell for reducing short circuit and battery incorporating the cell

A lithium-ion secondary battery which includes a battery element and an exterior package covering the battery element. The battery element includes a separator, and an electrode-stacked body having a first electrode and a second electrode disposed respectively on both surfaces of the separator in a stacking direction. The exterior package includes a first package member located at one side of the battery element in the stacking direction, and a second package member located at the other side of the battery element in the stacking direction. A linear expansion coefficient &#x3b1;1 of the first package member is greater than a linear expansion coefficient &#x3b1;2 of the second package member.

Lithium-ion secondary battery

A screen printing device configured to print a printing paste on a printed board, the printing paste being applied on a screen printing plate where openings corresponding to a pattern to be printed are formed, the screen printing device includes a first squeegee advanced and pressed downward so that the printing paste is pushed on the printed board corresponding to the openings of the screen printing plate; and a second squeegee situated in the vicinity of the rear of the first squeegee, the second squeegee being configured to provide pressure forward and downward, the pressure having properties different from properties of a pressure provided by the first squeegee, wherein a printing operation by the second squeegee is performed right after a printing operation by the first squeegee.

Screen printing method and apparatus including two squeegees with different lengths and pressures

A drive unit for an electric vehicle is comprised of a motor, an inverter which supplies alternating current electric power to the motor, a speed reducer which is connected to the motor, and a cooling system which cools the motor, the inverter and the speed reducer. The speed reducer reduces a revolution speed of a mechanical output of the motor. The cooling system comprises a heat exchanger at which first refrigerant for receiving heat of at least one of the motor and the inverter receives heat of second refrigerant for receiving heat of at least one of the motor and the speed reducer.

Drive unit for electric vehicle

A detachment jig is placed on a printed circuit board. Advancement of an inclined surface of the detachment jig is received on a solder bump of solid state disposed between the printed circuit board and an integrated circuit chip package. The solder bump melts to remove restraint to the advancement of the inclined surface, so that the inclined surface advances into a space between the printed circuit board and the chip package in response to the melt of the solder bump. A force to lift the chip package in the direction perpendicular to the surface of the printed circuit board acts on the chip package after the solder bump has completely melted down. Detachment of an electrically conductive pad is thus reliably prevented on the printed circuit board. The chip package can solely be removed without inducing detachment of the electrically conductive pad on the printed circuit board.

Method of removing integrated circuit chip package and detachment jig therefor

There are provided: compound semiconductor particles that can display more excellent performance in functions peculiar to the compound semiconductor (e.g. luminosity and luminescence efficiency); and a production process for obtaining such compound semiconductor particles with economy, good productivity, and ease. Compound semiconductor particles, according to the present invention, are characterized by comprising body particles and a metal oxide, wherein the body particles have particle diameters of smaller than 1 &#x3bc;m and are covered with the metal oxide and include a compound semiconductor including an essential element combination of at least one element X selected from the group consisting of C, Si, Ge, Sn, Pb, N, P, As, Sb, S, Se, and Te and at least one metal element M that is not identical with the element X, and wherein the metal oxide is a metal oxide to which an acyloxyl group is bonded.

Compound semiconductor particles and production process therefor

An electric motor structure includes a rotary shaft with a coolant passageway therein and a rotor with a cooling surface non-rotatably coupled to the rotary shaft. The coolant is supplied from the coolant passageway of the rotary shaft to the cooling surface of the rotor and flows along the cooling surface of the rotor as a liquid film. The electric motor structure is further provided with a coolant discharge restricting section configured and arranged to restrict discharging of the coolant from the cooling surface. The coolant discharge restricting section protrudes from the cooling surface in a direction substantially perpendicular to the cooling surface where the coolant flown along the cooling surface is discharged from the cooling surface. Thus, a high cooling performance is obtained even when the rotor rotates at high rotational speeds by maintaining a sufficient liquid film thickness.

Electric motor structure

An integrated drive motor unit which is integrally constituted of a motor, an inverter and a reducer differential unit arranged in a row, and a frame member. The reducer differential unit is connected to an output shaft of the motor, and distributes torque of the motor to a pair of axles, one of which passes through the inverter. The frame member constitutes a part of the motor and a part of the reducer differential unit, and has a portion surrounding the axle passing through the inverter. The inverter is disposed outside the frame member.

Integrated drive motor/differential/inverter unit with improved housing for a vehicle

The present invention provides a rinsing solution for lithography with which finely processed parts of a resist pattern can be well rinsed without corroding a metallic film made of Al, Al&mdash;Si, Al&mdash;Si&mdash;Cu, etc. and which is economically advantageous and has a high safety; and a method for processing a substrate with the use of the same. The rinsing solution contains at least one selected from the group consisting of ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether and ethyl lactate.

Rinsing solution for lithography and method for processing substrate with the use of the same

A coolant inlet and a coolant outlet are opened on an inner surface enclosing an inner space of a rotation object. The coolant inlet and the coolant outlet are located on a rotation axis and face each other. A main-stream which flows straightly along the rotation axis from the coolant inlet to the coolant outlet is generated in a central space of the inner space. Therefore, a resistance about the coolant stream is small. In addition, a sub-stream which circulates in a radial direction is generated in a peripheral space around the central space. By generating a contact between the main-stream and the sub-stream, it is possible to obtain high performance of cooling.

Cooling method and structure for a rotation object

A photoresist stripping solution which comprises (a) a salt of hydrofluoric acid with a base free from metal ions: (b) a water-soluble organic solvent; (c) a basic substance; and (d) water; and a method comprising etching a substrate using a photoresist pattern formed on the substrate as a mask, ashing the photoresist pattern, stripping the ashed photoresist pattern using the photoresist stripping solution as described above, and then rinsing the substrate with water. Thus, there are disclosed a photoresist stripping solution which is excellent not only in stripping away post-ashing residue (modified photoresist films) and post-etching residue (metal deposition) but also in protecting substrates from corrosion in the step of rinsing with water; and a method for stripping photoresists using the same.

Photoresist stripping solution and a method of stripping photoresists with the same

A heater sealed with carbon wire heating element has a carbon wire heating element sealed with a quartz glass member, the carbon wire being prepared by knitting carbon single fibers into a knitted cord of a braid, each wire having a crystal structure with a interlayer spacing d (002) thereof being 0.343 or less and crystallite size Lc (002) thereof being 4.0 nm or more.

Heater sealed with carbon wire heating element

The present invention provides a negative working resist composition comprising a diazosulfonic acid compound capable of generating an acid with irradiation of radiation and an organic amine compound. The negative working resist composition is excellent in sensitivity, resist pattern profile, and aging stability.

Negative working resist composition

Undercoating composition for photolithographic resist

Growing community of inventors

Yokosuka, Japan

Masakazu Kobayashi