Mitsubishi Denki Kabushiki Kaisha

Maeda & Associates

Masahiko Ikeno

Hideo Saeki

Hiroshi Kawashima

Yoko Miyazaki

Nobuyoshi Hattori

Toshiharu Katayama

Junko Izumitani

Osamu Kaneda

Kouetsu Sawai

An apparatus for inspecting a semiconductor device comprises a wafer stage ( ), a stage driving unit ( ), a charged-particle beam irradiation unit ( ), an electronic optical system ( ), a charged-particle beam control unit (12), a secondary-electron detection unit ( ), an amplifier ( ), a secondary-electron intensity comparison unit ( ), a database ( ) connected to an output of the secondary-electron intensity comparison unit ( ), a PC ( ) connected to an output of the database ( ) and a main control unit ( ) connected to the output of the database ( ) and an output of the PC ( ), whose output is connected to the stage driving unit ( ), the charged-particle beam irradiation unit ( ) and the charged-particle beam control unit ( ). The database ( ) stores inspection results and inspection addresses on m inspection regions ( ) with strong possibility of having opening failures of contact holes ( ) in each of a plurality of semiconductor wafers ( ).

Method of and apparatus for inspecting semiconductor device

A defect inspection apparatus includes a first main controller for producing a reflectance distribution in a wafer surface to generate illumination light control data, based on the reflectance distribution, the illumination light control data being control data for adjusting the intensity of illumination light so that the intensity of reflected light from all locations in the wafer surface reaches an average intensity value, and a filter controller for inputting a filter control signal to a filter, based on the illumination light control data. The transmittance or reflectance of the filter for illumination light is controlled by the filter control signal. Consequently, the intensity of light reflected from a wafer to be inspected is controlled to provide uniformity in the wafer surface. Therefore, the defect inspection apparatus detects a defect occurring in the object to be inspected with high accuracy.

Defect inspection apparatus

An ordinary user can easily learn a step at which a problem occurs during semiconductor manufacturing processes and improve the yield of manufacturing products and the quality of the products. At a certain in-line inspection step, a CPU (3) stores data signals (V1) taken by an inspection apparatus (1) into a memory (2), and reads a result (V6) obtained at a precedent step and stores the same in the memory (2). The CPU (3) reads stored data signals (V2) from the memory (2), performs comparison or referral on data about defects which are detected at a current step and the result (V6) regarding the precedent step, and generates a defect data analysis processing result signal (V5) regarding the current step. The result (V5) consists of disappeared defect data, common defect data, new defect data to which a label of a current step number is assigned, and reappeared defect data. The CPU (3) performs the processing above for each in-line inspection step, edits resultant data, and generates histogram data which provide the number of detected defects and the number of disappeared defects for each step.

Inspection data analyzing apparatus for in-line inspection with enhanced

A spin coating method includes the steps of applying a coating material on the surface of a substrate, rotating the substrate about a first axis, and revolving the substrate about a second axis while tilting the substrate towards the second axis. The rotating step spreads the coating material over the surface of the substrate, and the step of revolving while tilting the substrate smoothens the surface of the coating material. At least the rotating step may be performed in an atmosphere containing a solvent vapor. A spin coating apparatus includes a nozzle for applying a coating material to the surface of a substrate, a chuck for rotating the substrate about a first axis, a support arm for revolving the substrate about a second axis, and a tilting mechanism for tilting the surface of the substrate towards the center of the second axis while the substrate is revolving.

Spin coating method

A photoresist of sufficient thickness to fill a scribe line is applied to an entire substrate. The photoresist is exposed through a photomask having a pattern corresponding to the scribe line and then developed. A photosensitized gelatin is applied by spincoating on the flat substrate obtained in this process, pattern and then dyed, to obtain a color filter array.

Method for forming film of uniform thickness on semiconductor substrate

A photoresist of sufficient thickness to fill a scribe line is applied on an entire substrate. Then, the photoresist is exposed through a photomask having a pattern corresponding to the scribe line and is thereafter developed. A photosensitized gelatin is applied by spin-coating on the flat substrate obtained in this process, patterned, and then dyed, to obtain a color filter array.

Spin coating apparatus using a tilting chuck

A solid state imaging device has solid-state imaging-device chips each having a picture-element array and bonding pads, chip carriers each having long sides longer than the solid-state imaging-device chip and terminals electrically connected to corresponding bonding pads on the chip, a package board which carries the chip carriers, and external leads provided on the package board and electrically connected to the respective terminals of the chip carriers. In a method of assembling such a solid state imaging device, a plurality of solid-state imaging-device chips are mounted on respective chip carriers, and a plurality of imaging units are formed by electrically connecting the terminals of each chip carrier to the corresponding bonding pads. The imaging units are then arranged on the package board and the terminals of the imaging units are connected to the external leads, respectively. A test is conducted on the solid-state imaging-device chips of each imaging unit, and if a non-conforming chip is found, an imaging unit including the non-conforming chip is removed from the package board and a new imaging unit is secured to the package board in place of the removed chip.

Solid state imaging device

A color filter dyeing apparatus for dyeing a color filter formed on a substrate comprises a chuck for holding the substrate on which the color filter is mounted, a dyeing solution receptacle in intimate engagement, by means of a sealing member, with the chuck or the substrate, and forming a container for containing the color filter therein, an inlet for supplying the dyeing solution into the container, and means for discharging the dyeing solution from the container.

Color filter dyeing apparatus

A spin coating apparatus has a refrigerated container which maintains a coating liquid that contains thermosetting materials or thermal crosslinking agents at a temperature which is sufficiently below the temperature of a substrate on which it is to be coated such that the coating liquid will not set. A heat exchanger heats the coating liquid from the reduced temperature of the refrigerated container to the temperature of the substrate just before the coating liquid is applied to the substrate.

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Itami, Japan

Masahiko Ikeno