Mattson Technology, Inc

Tetron, Inc.

Martin L Hammond

Stephen E Savas

Brad S Mattson

Steven C Selbrede

Jean-Fran&ccedil;ois Daviet

Charles L Ramiller

Robert Mueller

A plasma reactor and methods for processing semiconductor wafers are described. Gases are introduced into a reactor chamber. An induction coil surrounds the reactor chamber. RF power is applied to the induction coil and is inductively coupled into the reactor chamber causing a plasma to form. A split Faraday shield is interposed between the induction coil and the reactor chamber to substantially block the capacitive coupling of energy into the reactor chamber which may modulate the plasma potential. The configuration of the split Faraday shield may be selected to control the level of modulation of the plasma potential. For etch processes, a separate powered electrode may be used to accelerate ions toward a wafer surface. For isotropic etching processes, charged particles may be filtered from the gas flow, while a neutral activated species passes unimpeded to a wafer surface.

Inductive plasma reactor

A method for in-situ cleaning of a hot wall RTP system. Internal components are heated to high temperatures above 500&deg; C. A halocarbon gas, inert gas and oxidizing gas are flowed through the reactor for a period which may exceed 20 minutes and then purged to remove contaminants.

Cleaning process for rapid thermal processing system

A method for controlling wafer temperature in a thermal reactor. A wafer is positioned between two or more surfaces, one or more of which are heated. A control temperature is calculated based on the temperatures of the surfaces. The heat applied to the surface(s) is adjusted in response to the control temperature in order to maintain the wafer temperature within narrowly defined limits.

Model based method for wafer temperature control in a thermal processing system for semiconductor manufacturing

A basic cell for a carrier of semiconductor wafers to permit high-volume, cold wall chemical vapor deposition, including plasma-enhanced CVD. The basic cell has two surfaces, each bearing a wafer or wafers facing and tapering toward each other. Process gases are passed from the wider gap to the narrower gap between the surfaces. Basic cells may be arranged to form a circular carrier with process gases flowing inward to the center of the carrier for a high volume CVD reactor. The basic cell may also be used for plasma etching reactors.

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Cupertino, CA, United States of America

Martin L Hammond