Shipley Company LLC

Martin J Harris

Stephen S Rodriguez

Ivan K Ho

Wayne T Smith

Method for selective and precise etching and plating of a conductive substrate through electrophoretic deposition of a photoresist composition. The invention enables chemical milling and plating of products useful in high performance applications such as lead frames with lead widths less than 1.0 mil and precisely plated lead faces.

Selective and precise etching and plating of conductive substrates

A method and apparatus for electrodeposition of insulating coatings such as photoresists having uniform thickness throughout the coating. The apparatus comprises one or more cathodes disposed in a bath containing an electrophoretic depositing composition, one or more anodes disposed in said bath in face to face relationship with the cathode, and means for applying a voltage between the anode and the cathode to produce a current whereby a current density gradient is formed on the cathode, the gradient comprising high and low current density areas. The anode of the present invention is configured so that the anode is concentrated opposite the high current density areas of the cathode, thereby controlling the thickness of deposition by controlling the amount of current flowing to the cathode.

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Leominster, MA, United States of America

Martin J Harris