Advanced Micro Devices Corporation

Spansion Llc.

Microelectronics and Computer Technology Corporation

Mark R Breen

Richard D Nelson

Robert W Froehlich

Thomas Alan Bishop

Ernest R Nolan

Chung J Lee

Randy L German

Diana C Duane

Kimcuc T Tran

William Scott Bass

Kathryn V Keswick

Lynette K Ballast

Todd H Herder

A method is provided for fabricating a semiconductor device having a gate electrode overlying a gate insulator. The method, in accordance with one embodiment, comprises depositing a layer of spin on glass overlying the gate electrode, the layer of spin on glass comprising a substantially UV opaque material. The layer of spin on glass is heated to a temperature less than about 450&#xb0; C., and all subsequent process steps in the fabrication of the device are limited to temperatures less than about 450&#xb0; C.

Method for fabricating a semiconductor device

Various methods of inspecting a workpiece for residue are provided. In one aspect, a method of inspecting a workpiece for carbon residue includes directing coherent radiation at the workpiece to produce Rayleigh scattered radiation and Raman scattered radiation. The Rayleigh scattered radiation is filtered out. A spectrum for the Raman scattered radiation is detected and compared with a known Raman spectrum for carbon. Wafers may be inspected for residues, such as graphitic carbon, in a non-destructive way and without pump down. Deficiencies in resist stripping may be quickly identified.

Resist removal monitoring by raman spectroscopy

Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump forming step includes the steps of coating a polymer material on a substrate, curing the polymer and the etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal such as gold on the polymer bump.

Compliant electrically connective bumps for an adhesive flip chip

Growing community of inventors

Austin, TX, United States of America

Mark R Breen