Kla-tencor Technologies Corporation

Kla Tencor Corporation

Park Scientific Instruments

Thermomicroscopes Corporation

Advanced Bionics Corporation

Marco Tortonese

John D Alexander

Ellen R Laird

Thai Nguyen

Rene Blanquies

Mehran Nasser-Ghodsi

Ian R Smith

Pat Brady

Jerry Prochazka

Christopher F Bevis

Matthew Isaac Haller

Timothy Beerling

Michael D Kirk

Timothy G Slater

Bradley W Scheer

Sean S Cahill

Dimitar Ovtcharov

Ren&eacute; Maurice Blanquies

René M Blanquies

A stylet for inserting an electrode array into a cochlea includes a first sensor insertable within a lumen of the electrode array and sensitive to force applied by a lumen wall to the first sensor and a first actuator adapted to move the electrode array in response to the force sensed by the first sensor.

Steerable stylet

A method for calibrating a computer program that simulates a physical process and a photomask are disclosed. A first physical artifact may be exposed to the physical process to produce a second physical artifact. The first physical artifact may include one or more features characterized by traceably measured known dimensions. One or more features of the second physical artifact may be measured to produce one or more measured dimensions. The physical process may be simulated with a computer simulation using the known dimensions of the first physical artifact as inputs to produce an output. The output may be compared to the measured dimensions of the second physical artifact to produce a result. A figure of merit may be assigned to the computer simulation based on the result. The photomask may have one or more features with one or more traceably measured dimensions.

Verification of computer simulation of photolithographic process

Calibration of measurements of features made with a system having a micromachining tool and an analytical tool is disclosed. The measurements can be calibrated with a standard having a calibrated feature with one or more known dimensions. The standard may have one or more layers including a single crystal layer. The calibrated feature may include one or more vertical features characterized by one or more known dimensions and formed through the single crystal layer. A trench is formed in a sample with the micromachining tool to reveal a sample feature. The analytical tool measures one or more dimensions of the sample feature corresponding to one or more known dimensions of the calibrated feature. The known dimensions of the calibrated feature are measured with the same analytical tool. The measured dimensions of the sample feature and the calibrated feature can then be compared to the known dimensions of the calibrated feature.

Calibration standard for a dual beam (FIB/SEM) machine

A calibration standard, for calibrating lateral or angular dimensional measurement systems, is provided. The standard may include a first substrate spaced from a second substrate. The standard may be cross-sectioned in a direction substantially perpendicular or substantially non-perpendicular to an upper surface of the first substrate. The cross-sectioned portion of the standard may form a viewing surface of the calibration standard. The standard may include at least one layer disposed between the first and second substrates. The layer, or a feature etched into the first or second substrate or a feature etched into the layer may have a traceably measured thickness or may be oriented at a traceably measured angle with respect to the viewing surface. A thickness or angle of the layer or other feature may be traceably measured using any technique for calibrating a measurement system with a standard reference material traceable to a national testing authority.

Dimensional calibration standards

In one embodiment, an atomic force microscope comprises a frame, a beam coupled to the frame at a first end and a second end, a probe mounted to the beam, means for inducing relative motion between the beam and an underlying surface, and means for detecting a characteristic of the beam.

Atomic force microscope

A process and structure for mounting a small sample in an opening in a larger substrate by using an intermediate size structure, wherein the small sample is mounted in a small opening in the intermediate size structure which then, in turn, is mounted in an intermediate size opening in the large substrate. As a result, the formation of gaps around the edge of the sample may be voided. The process is carried out by first mounting the test sample in a opening formed with tapered sidewalls through a die with the upper surface of the sample directly abutting the edges of the smallest portion of the tapered opening in the die, The die is then mounted in an opening with tapered sidewalls in a test wafer. The opening in the die is sized to equal, at the smallest end of the tapered sidewalls of the opening, the width and length of the square sample. By placing down on a common flat surface abutting one another, both the surface of interest of the sample, and the surface of the die adjacent the smallest portion of the tapered sidewall opening, the die and the sample may be secured to one another by an adhesive introduced into the gap on the respective rear sides of the die and sample. Virtually no gap is visible between the surface of the sample and the surface of the die abutting one another when the sample and the die are joined in this manner. The secured-together die and sample are then inverted and placed in a larger opening in the test wafer and then bonded to the wafer. When a gap is thus formed between the wafer and the die, this is usually far enough from the sample so as to not be within the field of view of equipment focused on the sample.

Structure and method for mounting a small sample in an opening in a larger substrate

A calibration standard which may be used to calibrate lateral dimensional measurement systems is provided. The calibration standard may include a first substrate spaced from a second substrate. In addition, the calibration standard may include at least one layer disposed between the first and second substrates. The layer may have a traceably measured thickness. For example, a thickness of the layer may be traceably measured using any measurement technique in which a measurement system may be calibrated with a standard reference material traceable to a national testing authority. The calibration standard may be cross-sectioned in a direction substantially perpendicular to an upper surface of the first substrate. The cross-sectioned portion of the calibration standard may form a viewing surface of the calibration standard. In this manner, a lateral dimensional artifact of the calibration standard may include the traceably measured thickness of at least the one layer.

Submicron dimensional calibration standards and methods of manufacture and use

A scanning mechanism is provided for use in a scanning probe microscope. The scanning mechanism includes a stationary portion; a moveable portion; a plurality of springs attaching the moveable portion to the fixed portion, the plurality of springs providing tension against movement of the moveable portion relative to the stationary portion, the tension provided by the plurality of springs having a substantially linear spring constant over a scan distance; and one or more voice coils attached to either the moveable portion or the stationary portion for moving the moveable portion relative to the stationary portion in one or more orthogonal directions.

Voice coil scanner for use in scanning probe microscope

Atomic force microscope system is provided which is designed to be incorporated into or attachable to an objective lens which can be mounted on a lens turret of an optical microscope such that simultaneous atomic force microscopy and optical viewing of a sample through the objective lens can be performed. In one embodiment, the atomic force microscope (AFM) is designed to be removably attached to a standard objective lens of an optical microscope. In another embodiment, the AFM system is designed to be removably attached to an optical microscope and includes integrated optics for providing an optical view. In both embodiments, the optics are used solely for generating an optical view and/or other optical contrast mechanisms and are not used in conjunction with a detection mechanism of the AFM.

Atomic force microscope with integrated optics for attachment to optical

Atomic force microscope for attachment to optical microscope

A cantilever for a scanning probe microscope is disclosed. The cantilever includes a piezoresistor for detecting the deflection of the cantilever, and a tip which is formed integrally with the cantilever. A process of fabricating such a cantilever is also disclosed, the process yielding a tip which has a high aspect ratio and a small radius of curvature at its apex. A combined atomic force/lateral force microscope including two or more piezoresistors responsive to both the bending and torsion of the cantilever is also disclosed.

Growing community of inventors

Mountain View, CA, United States of America

Marco Tortonese