Applied Materials, Inc.

Manjunath Veerappa Chobari Patil

Rui Cheng

Diwakar N Kedlaya

Zubin Huang

Venkata Sharat Chandra Parimi

Yi Yang

Badri N Ramamurthi

Nitin Pathak

Truong Van Nguyen

Exemplary semiconductor processing chambers include a chamber body defining a processing region. The chambers may include a substrate support disposed within the processing region. The substrate support may have an upper surface that defines a recessed substrate seat. The chambers may include a shadow ring disposed above the substrate seat and the upper surface. The shadow ring may extend about a peripheral edge of the substrate seat. The chambers may include bevel purge openings defined within the substrate support proximate the peripheral edge. A bottom surface of the shadow ring may be spaced apart from a top surface of the upper surface to form a purge gas flow path that extends from the bevel purge openings along the shadow ring. A space formed between the shadow ring and the substrate seat may define a process gas flow path. The gas flow paths may be in fluid communication with one another.

Methods to eliminate of deposition on wafer bevel and backside

Growing community of inventors

Karnataka, India

Manjunath Veerappa Chobari Patil